Lid attach process
View Patent ↗Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
1. A method of attaching a lid to a substrate having an integrated circuit positioned thereon, comprising:
applying an adhesive to the substrate;
applying an indium film to the integrated circuit;
positioning the lid on the adhesive;
partially hardening the adhesive without reflowing the indium film;
reflowing the indium film after the adhesive has been partially hardened; and
curing the adhesive;
wherein the curing of the adhesive is performed without applying compressive force to the lid.
2. The method of claim 1 , wherein the partial hardening of the adhesive is performed while compressive force is applied to the lid.
3. The method of claim 1 , wherein the partial hardening is by heating.
4. The method of claim 1 , wherein the integrated circuit has a footprint, the step of applying the indium film comprises positioning a sheet of indium having a footprint substantially matching the footprint of the integrated circuit.
5. The method of claim 1 , comprising heating the lid before positioning the lid on the adhesive.
6. The method of claim 1 , wherein the reflowing of the indium and the curing of the adhesive comprise heating.
7. The method of claim 1 , wherein the positioning of the lid on the adhesive comprises using an automated machine to pick and place the lid on the adhesive.
8. A method of manufacturing, comprising:
mounting an integrated circuit to a substrate whereby a backside of the integrated circuit faces away from the substrate;
applying an adhesive to the substrate;
placing a lid on the adhesive, the lid having an underside;
positioning an indium film between the backside of the integrated circuit and the underside of the lid;
fixing a bond line thickness of the indium by partially hardening the adhesive without reflowing the indium film;
reflowing the indium film with the fixed bond line thickness after the adhesive has been partially hardened; and
curing the adhesive;
wherein the curing of the adhesive is performed without applying compressive force to the lid.
9. The method of claim 8 , comprising providing the backside of the integrated circuit with a first wetting film and the underside of the lid with a second wetting film.
10. The method of claim 8 , wherein the partial hardening of the adhesive is performed while compressive force is applied to the lid.