Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign
View Patent ↗An ASIC includes a function layer formed with plural universal logic cells, a common layer formed with conductive strips connected to the universal logic cells and common to other ASICs and a customized layer having at least two metallization layers assigned to conductive strips extending in certain directions parallel to one another and other conductive strips extending in perpendicular directions to the certain directions, respectively, and an inter-layered insulating layer formed with conductive plugs selectively connected between the conductive strips and the other conductive strips, wherein the conductive strips have respective values of length such that the conductive plugs are located on both ends thereof, whereby the conductive strips, other conductive strips and the conductive plugs form plural signal paths reduced in total contact resistance and parasitic capacitance.
1. A semi-custom-made integrated circuit device comprising:
a function layer formed with function blocks on a substrate; and
a multi-layered metallization structure formed over said function layer, and including:
at least one common wiring pattern layer having at least one wiring pattern connected to said function blocks and common to plural sorts of semi-custom-made integrated circuit devices; and
a customized layer formed on said at least one common layer said customized layer unique to said semi-custom-made integrated circuit device and including:
a lower metallization layer having a first pattern of wiring strips selectively connected to said function blocks and directed in certain directions parallel to one another,
an upper metallization layer having a second pattern of wiring strips directed in directions perpendicular to said certain directions; and
an inter-layered insulating layer inserted between said lower metallization layer and said upper metallization layer and having a third pattern of wiring plugs selectively connected between the wiring strips of said first pattern and the wiring strips of said second pattern, said wiring strips of said first pattern have a length such that said wiring strips of said first pattern are selectively connected at both ends thereof to said function blocks and said wiring strips of said second pattern.
2. The semi-custom-made integrated circuit device as set forth in claim 1 , in which selected ones of said wiring strips of said first pattern and selected ones of said second patterns form plural signal paths propagating signals from or to said function blocks.
3. The semi-custom-made integrated circuit device as set forth in claim 2 , in which at least one of said wiring strips of said second pattern is connected to one of said function blocks so as to supply a power voltage thereto.
4. The semi-custom-made integrated circuit device as set forth in claim 1 , in which at least one of said wiring strips of said second pattern is connected to one of said function blocks so as to supply a power voltage thereto.
5. The semi-custom-made integrated circuit device as set forth in claim 1 , in which said at least one wiring pattern in said at least one common layer includes a signal path for propagating a clock signal.
6. The semi-custom-made integrated circuit device as set forth in claim 1 , in which three of said common layers are formed as ready-made layers.
7. The semi-custom-made integrated circuit device as set forth in claim 1 , in which said semi-custom-made integrated circuit device is a master slice.
8. A semi-custom-made integrated circuit device comprising:
a function layer formed with function blocks on a substrate; and
a multi-layered metallization structure formed over said function layer, and including:
at least one common wiring pattern layer having at least one wiring pattern connected to said function blocks and common to plural sorts of semi-custom-made integrated circuit devices; and
a customized layer formed on said at least one common layer said customized layer unique to said semi-custom-made integrated circuit device and including:
a lower metallization layer having a first pattern of wiring strips selectively connected to said function blocks and directed in certain directions parallel to one another,
an upper metallization layer having a second pattern of wiring strips directed in directions perpendicular to said certain directions; and
an inter-layered insulating layer inserted between said lower metallization layer and said upper metallization layer and having a third pattern of wiring plugs selectively connected between the wiring strips of said first pattern and the wiring strips of said second pattern,
in which at least one of said wiring strips of said second pattern, at least one combination of the wiring strips of said first and second patterns, at least one wiring pattern in said at least one common layer and another wiring pattern in said at least one common layer propagate a power voltage, a signal, a clock signal and a test signal to said function blocks, respectively.