Substrate treating apparatus and method
View Patent ↗A substrate treating apparatus includes a treating unit for treating substrates, a piping for supplying a treating liquid to the treating unit, a heater mounted on the piping, an electronic thermal unit mounted on the piping in series with the heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling the heater and the electronic thermal unit. The controller sets a first temperature control mode for performing a room temperature control using the electronic thermal unit when the temperature measured by the temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control with the heater when the temperature measured by the temperature sensor is above the predetermined boundary temperature between room temperature and high temperature. The controller sets a second temperature control mode for performing a heating control using the heater and the electronic thermal unit to heat the treating liquid when a difference between the temperature measured by the temperature sensor and a target temperature at least corresponds to a first specified value set beforehand. Further, the controller sets the first temperature control mode when, after the second temperature control mode is set, the difference between the temperature measured by the temperature sensor and the target temperature becomes less than a second specified value set beforehand.
1. A substrate treating method for treating substrates in a substrate treating apparatus having a treating unit for treating substrates, a piping for supplying a treating liquid to said treating unit, a heater mounted on said piping, an electronic thermal unit mounted on said piping in series with said heater, a temperature sensor for measuring a temperature of the treating liquid, and a controller for controlling said heater and said electronic thermal unit, said method comprising the steps, executed by said controller, of:
setting a first temperature control mode for performing a room temperature control using said electronic thermal unit when the temperature measured by said temperature sensor is below a predetermined boundary temperature between room temperature and high temperature, and for performing a high temperature control using said heater when the temperature measured by said temperature sensor is above the predetermined boundary temperature between room temperature and high temperature;
setting a second temperature control mode for performing a heating control using said heater and said electronic thermal unit to heat the treating liquid when a difference between the temperature measured by said temperature sensor and a target temperature at least corresponds to a first specified value set beforehand;
determining, after said second temperature control mode is set, whether the difference between the temperature measured by said temperature sensor and the target temperature becomes less than a second specified value set beforehand;
setting said first temperature control mode when, after said second temperature control mode is set, the difference between the temperature measured by said temperature sensor and the target temperature becomes less than the second specified value set beforehand; and
continuing said second temperature control mode when the difference between the temperature measured by said temperature sensor and the target temperature becomes not less than the second specified value set beforehand.
2. A method as defined in claim 1 , wherein said controller performs a PID control of said electronic thermal unit in time of said room temperature control, and performs a PID control of said heater in time of said high temperature control.