Positive type radiation-sensitive resin composition
A positive type radiation-sensitive resin composition suitable as a chemically-amplified resist sensitive to active radiation particularly to deep ultraviolet rays represented by a KrF excimer laser, an ArF excimer laser, or an F 2 excimer laser, excelling particularly in a process margin for the KrF excimer laser is provided. The positive type radiation-sensitive resin composition comprises a photoacid generator and an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid, wherein the photoacid generator is a mixed photoacid generator containing a photoacid generator of the following formula (1) and a photoacid generator which is at least one compound selected from sulfonyloxyimide and disulfonyldiazomethane.
1. A positive type radiation-sensitive resin composition comprising
(A) a photoacid generator and (B) an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid,
wherein (A) the photoacid generator comprises a mixed photoacid generator containing (A1) a photoacid generator of the following formula (1) and (A2) a photoacid generator which is at least one compound selected from the group consisting of sulfonyloxyimides and disulfonyldiazomethanes,
wherein R 1 represents a same or different monovalent organic group containing fluorine atoms, or a fluorine atom, R 2 represents a same or different monovalent organic group containing no fluorine atoms, or a hydrogen atom, n and m are integers of 1-5, and X − represents an anion of camphorsulfonic acid or nonafluorobutanesulfonic acid.
2. The positive type radiation-sensitive resin composition according to claim 1 , wherein (B) the acid-labile group-containing resin comprises a recurring unit of the following formula (2),
wherein R 3 represents a hydrogen atom or a methyl group, R 4 represents a monovalent organic group, two or more R 4 individually represent same or different, s is an integer of 1-3, and t is an integer of 0-3, provided that s+t≦5.
3. The positive type radiation-sensitive resin composition according to claim 2 , wherein the X − is the anion of camphorsulfonic acid.
4. The positive type radiation-sensitive resin composition according to claim 3 , wherein (A2) the photoacid generator comprises a sulfonyloxyimide.
5. The positive type radiation-sensitive resin composition according to claim 4 , wherein the photoacid generator comprises a plurality of different sulfonyloxyimides.
6. The positive type radiation-sensitive resin composition according to claim 3 , wherein (A2) the photo acid generator comprises a disulfonyldiazomethane.
7. The positive type radiation-sensitive resin composition according to claim 2 , wherein the X − is the anion of nonafluorobutanesulfonic acid.
8. The positive type radiation-sensitive resin composition according to claim 7 , wherein (A2) the photoacid generator comprises a sulfonyloxyimide.
9. The positive type radiation-sensitive resin composition according to claim 8 , wherein the photoacid generator comprises a plurality of different sulfonyloxyimides.
10. The positive type radiation-sensitive resin composition according to claim 7 , wherein (A2) the photoacid generator comprises a disulfonyldiazomethane.
11. The positive type radiation-sensitive resin composition according to claim 2 , wherein (B) the acid-labile group-containing resin further comprises a recurring unit which is at least one recurring unit selected from the group consisting of a recurring unit of the following formula (3) and a recurring unit of the following formula (4),
wherein R 5 represents a hydrogen atom or a methyl group, R 6 represents a monovalent organic group, R 7 represents a monovalent acid-labile group, p is an integer of 1-3, q is an integer of 0-3, provided that p+q≦5 of the formula (3), R 8 represents a hydrogen atom or a methyl group, and R 9 represents a t-butyl group, a 1-methylcyclopentyl group or a 1-ethylcyclopentyl group of the formula (4).
12. The positive type radiation-sensitive resin composition according to claim 1 , wherein the photoacid generator (A) consists of a photoacid generator of the formula (1) and at least one compound selected from the group consisting of sulfonyloxyimides and disulfonyldiazomethanes.
13. The positive type radiation-sensitive resin composition according to claim 1 , wherein the photoacid generator (A) further comprises a photoacid generator (A3) selected from the group consisting of an onium salt, a sulfone compound, a sulfonic acid ester compound, an oximesulfonate compound and a hydrazinesulfonate compound.
14. The composition of claim 13 , wherein the photoacid generator (A3) is an onium salt.
15. A positive type radiation-sensitive resin composition comprising
(A) a photoacid generator and (B) an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid,
wherein (A) a photoacid generator of the following formula (1) and (A2) a photoacid generator which is at least one compound selected from the group consisting of sulfonyloxyimides and disulfonyldiazomethanes,
wherein each R 1 represents a same or different monovalent organic group consisting fluorine atoms or a fluorine atom, R 2 independently represents a same or different monovalent organic group containing no fluorine atoms, n and m are integers of 1-5, and X − represents an anion of camphorsulfonic acid or nonafluorobutanesulfonic acid.
16. The positive type radiation-sensitive resin composition according to claim 15 , wherein (B) the acid-labile group-containing resin comprises a recurring unit of the following formula (2),
wherein R 3 represents a hydrogen atom or a methyl group, R 4 represents a monovalent organic group, two or more R 4 represent same or different, s is an integer of 1-3, and t is an integer of 0-3, provided that s+t≦5.
17. The positive type radiation-sensitive resin composition according to claim 16 , wherein the X − is the anion of camphorsulfonic acid.
18. The positive type radiation-sensitive resin composition according to claim 17 , wherein (A2) the photoacid generator is a sulfonyloxyimide.
19. The positive type radiation-sensitive resin composition according to claim 17 , wherein (A2) the photoacid generator is a disulfonyldiazomethane.
20. The positive type radiation-sensitive resin composition according to claim 16 , wherein the X − is the anion of nonafluorobutanesulfonic acid.
21. The positive type radiation-sensitive resin composition according to claim 20 , wherein (A2) the photoacid generator is a sulfonyloxyimide.
22. The positive type radiation-sensitive resin composition according to claim 20 , wherein (A2) the photoacid generator is a disulfonyldiazomethane.
23. The positive type radiation-sensitive resin composition according to claim 16 , wherein (B) the acid-labile group-containing resin further comprises a recurring unit which is at least one recurring unit selected from the group consisting of a recurring unit of the following formula (3) and a recurring unit for the following formula (4),
wherein R 5 represents a hydrogen atom or a methyl group, R 6 represents a monovalent organic group, R 7 represents a monovalent acid-labile group, p is an integer of 1-3, q is an integer of 0-3, provided that p+q≦5 of the formula (3), R 8 represents a hydrogen atom or a methyl group, and R 9 represents t-butyl group, 1-methylcyclopentyl group or 1-ethylcyclopentyl group of the formula (4).