IP Library Granted Patent US 7,830,165
Granted Patent B2
US 7,830,165 · App. 11/394,784 · Granted Nov 9, 2010

System and method for detecting single event latchup in integrated circuits

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Quick Facts
Patent No.
US 7,830,165
App. No.
11/394,784
Granted
Nov 9, 2010
Kind
B2
Abstract

A method for testing an integrated circuit for potential latchup sites includes applying a voltage to the integrated circuit, measuring a current through the integrated circuit, applying at least one radiation beam to at least one area of the integrated circuit, and detecting an occurrence of a latchup by detecting an increase of the current through the integrated circuit upon applying the at least one radiation beam to the at least one area of the integrated circuit.

Claims (44)

1. A method for testing an integrated circuit for potential latchup sites, comprising:

applying a power supply voltage and a programming voltage to the integrated circuit;

monitoring a power supply current and programming voltage current flowing through the integrated circuit;

monitoring the power supply voltage and the programming voltage;

applying a radiation beam to at least one area of the integrated circuit;

scanning the radiation beam through the integrated circuit;

adjusting a scanning resolution of the radiation beam on the integrated circuit by adjusting a spot size of the radiation on the integrated circuit;

adjusting a moving speed of the radiation beam on the integrated circuit after adjusting the spot size of the radiation;

detecting an occurrence of a latchup at the radiation spot by detecting a change in the programming voltage current through the integrated circuit upon applying the radiation beam; and

recording a location of the radiation spot on the integrated circuit when the programming voltage current changes.

2. The method of claim 1 , wherein applying radiation includes applying a laser beam.

3. The method of claim 2 , wherein the radiation is electromagnetic radiation with a wavelength of between 350 nm and 1060 nm.

4. The method of claim 1 , wherein applying radiation includes applying a plurality of radiation beams.

5. The method of claim 4 , wherein each of the plurality of radiation beams scans separate areas of the integrated circuit.

6. The method of claim 1 , wherein applying radiation to at least one area of the integrated circuit includes scanning the at least one area of the integrated circuit by moving a radiation beam point-by-point over the at least one area.

7. The method of claim 1 , wherein applying radiation to at least one area of the integrated circuit includes applying a pulsed radiation beam to the at least one area the integrated circuit.

8. The method of claim 7 , wherein the pulsed radiation beam is a pulsed laser beam with a pulse frequency of between 1 Hz and 20 Hz.

9. The method of claim 1 , wherein applying radiation to at least one area of the integrated circuit includes pinpointing particular points on the integrated circuit with the radiation beam.

10. The method of claim 1 , wherein the radiation is laser energy which is between 0.01 mJ and 0.05 mJ.

11. The method of claim 1 , wherein the programming voltage is applied to the integrated circuit through a programming voltage supply pin of the integrated circuit.

12. The method of claim 11 further including applying the power supply voltage to the integrated circuit through a power supply pin of the integrated circuit.

13. The method of claim 12 further including measuring the power supply current through the power supply pin.

14. The method of claim 11 , wherein the programming voltage current is measured through the programming voltage supply pin.

15. The method of claim 1 , wherein detecting an occurrence of a latchup by detecting a change in the programming voltage current through the integrated circuit upon applying the radiation to the at least one area of the integrated circuit includes detecting an occurrence of a latchup by detecting an increase of the programming voltage current through the integrated circuit over a predefined threshold value upon applying the radiation to the at least one area of the integrated circuit.

16. A system for testing an integrated circuit for potential latchup sites, comprising:

a radiation source configured to generate a radiation beam and scan through at least one area of the integrated circuit with the radiation beam, adjust a scanning resolution of the radiation beam on the integrated circuit by adjusting a spot size of the radiation beam on the integrated circuit, and adjusting a moving speed of the radiation beam on the integrated circuit:

a power supply configured to apply a power supply voltage and a programming voltage to the integrated circuit; and

voltage monitors configured to monitor the power supply voltage and the programming voltage applied to the integrated circuit;

a current measuring device configured to measure a programming voltage current passing through the integrated circuit, the current measuring device detecting whether a latchup occurs at the radiation beam spot upon applying the radiation to the at least one area of the integrated circuit by detecting an increase in measured programming voltage current through the integrated circuit; and

a controller that records a location of the radiation on the integrated circuit when the programming voltage current increases.

17. The system of claim 16 , wherein the radiation source includes a laser source.

18. The system of claim 16 , wherein the radiation source is configured to generate and apply a pulsed radiation beam to the at least one area of the integrated circuit.

19. The system of claim 18 , wherein the pulsed radiation beam is a pulsed laser beam with a pulse frequency of between 1 Hz and 20 Hz.

20. The system of claim 19 , wherein the pulsed laser beam has a pulsed energy of between 0.01 mJ and 0.05 mJ.

21. The system of claim 19 , wherein the pulsed laser beam has a wavelength of between 350 nm and 1060 nm.

22. The system of claim 16 , wherein the radiation source is configured to pinpoint particular points on the integrated circuit with a radiation beam.

23. The system of claim 16 , wherein the current measuring device is configured to detect whether a latchup occurs upon applying the radiation to the at least one area of the integrated circuit by detecting a change in measured programming voltage current over a predefined threshold value through the integrated circuit.

24. A system for testing an integrated circuit for potential latchup sites, comprising: means for applying at least one radiation beam to at least one area of the integrated circuit, scanning the at least one area with the radiation beam, adjusting a scanning resolution by adjusting a spot size of the radiation beam on the integrated circuit, and adjusting a moving speed of the radiation beam on the integrated circuit; means for applying a power supply voltage and a programming voltage to the integrated circuit; means for monitoring the power supply voltage and the programming voltage applied to the integrated circuit; means for monitoring a programming voltage current through the integrated circuit, and detecting an occurrence of a latchup by detecting a change in the programming voltage current through the integrated circuit upon applying the at least one radiation beam to the at least one area of the integrated circuit; and means for recording a location of the radiation beam on integrated circuit when the programming voltage current changes.

25. The system of claim 24 , wherein means for applying at least one radiation beam to at least one area of the integrated circuit includes means for generating a laser beam to scan the at least one area of the integrated circuit.

26. The system of claim 24 , wherein means for applying at least one radiation beam to at least one area of the integrated circuit includes means for generating a pulsed laser and applying the pulsed laser to the at least one area the integrated circuit.

27. The system of claim 26 , wherein the pulsed laser has a pulse frequency of between 1 Hz and 20 Hz.

28. The system of claim 24 , wherein means for applying at least one radiation beam to at least one area of the integrated circuit includes means for pinpointing particular points on the integrated circuit with the at least one radiation beam.

29. The system of claim 24 , wherein the at least one radiation beam has a wavelength of between 350 nm and 1060 nm.

30. The system of claim 24 , wherein the at least one radiation beam has an energy of between 0.01 mJ and 0.05 mJ.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2006
From: CHU, TAN VAN; MUI, KEN-CHUEN
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 017715/0417 →