Apparatus and system for an IC substrate, socket, and assembly
View Patent ↗An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.
1. An apparatus, comprising:
a substrate having a plurality of through-holes therethrough; and
an integrated circuit (IC) socket frame to mount to the substrate, the IC socket frame comprising:
a socket frame body; and
a plurality of beam features, each of the plurality of beam features located at spaced apart discrete locations on the socket frame body without a connecting sidewall between the plurality of beam features, extending from the socket frame body, and corresponding in arrangement to the plurality of through-holes through the substrate, wherein at least one of the plurality of beam features includes an orientation feature to orientate the substrate to the IC socket frame.
2. The apparatus of claim 1 , wherein the plurality of through-holes are shaped and sized to receive the plurality of beam features therethrough.
3. The apparatus of claim 1 , wherein the plurality of through-holes and the plurality of beam features have corresponding mating shapes selected from the group of: an “L” shape, a circular shape, a triangular shape, a rectangular shape, and a combination of different shapes.
4. The apparatus of claim 1 , wherein the plurality of beam features have a through-hole extending therethrough from a first end of the beam feature, to a second end of the beam feature, and through the socket frame body.
5. The apparatus of claim 1 , wherein the plurality of beam features provide a mechanism to facilitate at least one of the following:
alignment and support of the substrate, alignment of an IC socket frame retention mechanism to the apparatus, and alignment of a thermal management mechanism to the apparatus.
6. The apparatus of claim 1 , wherein the substrate further comprises at least one orientation feature to correspond to the orientation feature of the at least one of the plurality of beam features.
7. The apparatus of claim 1 , further comprising an array of pin contacts on an upper region of the socket frame body to engage with a plurality of pins on the substrate.
8. The apparatus of claim 1 , further comprising a plurality of conductive contacts on a lower surface of the socket frame body.
9. An integrated circuit (IC) socket frame to connect to a substrate, comprising:
a socket frame body; and
a plurality of beam features extending from the socket frame body, each of the plurality of beam features spaced apart from the others of the plurality of beam features without a connecting sidewall between the plurality of beam features and having a first end connected to an upper surface of the socket frame and a second end spaced apart from the socket frame body, wherein at least one of the plurality of beam features includes an orientation feature to orientate the substrate to the IC socket frame.
10. The IC socket frame of claim 9 , wherein the plurality of beam features have a through-hole extending therethrough from the first end thereof to the second end thereof.
11. The IC socket frame of claim 10 , wherein through-hole further extends through the socket frame body.
12. The IC socket frame of claim 9 , wherein the plurality of beam features have an exterior shape selected from the group of: an “L” shape, a circular shape, a triangular shape, a rectangular shape, and a combination of different shapes.
13. The IC socket frame of claim 9 , wherein the orientation feature is selected from the group of: a shape of the beam feature, a size of the beam feature, and combinations thereof.
14. The IC socket frame of claim 9 , further comprising an array of pin contacts on an upper region of the socket frame body to engage with a plurality of pins of an IC.
15. A system comprising:
an integrated circuit (IC) substrate having a plurality of through-holes therethrough;
an socket frame to mount to the IC substrate, the socket frame comprising:
a socket frame body; and
a plurality of beam features extending from the socket frame body, each of the plurality of beam features located at spaced apart discrete locations on the socket frame body without a connecting sidewall between the plurality of beam features and corresponding to the plurality of through-holes through the IC substrate, wherein at least one of the plurality of through-holes includes an orientation feature; and
a double data rate memory electrically coupled to the IC substrate.
16. The system of claim 15 , wherein at least one of the plurality of beam features includes an orientation feature.
17. The system of claim 15 , further comprising a mechanism to retain the IC substrate in a fixed relationship with the socket frame.