Embedding device in substrate cavity

1. A method comprising:

forming a cavity in a substrate having a substrate surface, the cavity having a depth;

placing a first device having a device surface and a thickness into the cavity, the thickness matching the depth such that the device surface is approximately planar with the substrate surface; and

attaching the first device to a second device via bumps on the second device; wherein attaching the first device to the second device comprises:

filling the cavity with a solder resist;

forming solder bumps on the substrate surface and on the solder resist; and

reflowing the bumps on the second device to the solder bumps.

2. The method of claim 1 wherein forming the cavity comprises:

depositing a metal layer on a substrate core.

3. The method of claim 2 wherein forming the cavity further comprising:

depositing a dielectric layer on the metal layer;

depositing a solder resist on the dielectric layer; and

routing the cavity to fit the first device.

4. The method of claim 3 wherein routing the cavity comprises:

drilling the solder resist and the dielectric layer using one of an etching process, a laser drilling, and a mechanical drilling bit.

5. The method of claim 2 wherein forming the cavity further comprises:

depositing a dielectric layer on the metal layer;

drilling the dielectric layer using a laser;

plating electroless metal on the drilled dielectric layer;

laminating a dry film resist (DFR) on the metal plated dielectric layer; and

patterning interconnect with electrolytic metal plating using a semi additive process (SAP).

6. The method of claim 5 wherein forming the cavity further comprises:

etching the DFR to expose the cavity.

7. The method of claim 1 wherein the first device is a memory device and the second device is a processor.