Devices and methods for protecting handheld electronic devices from electrostatic discharge
The present invention provides methods and devices for protecting electronic components of handheld electronic devices from electrostatic discharge. An electronic device in accordance with the present invention includes an enclosure having first and second housing portions, a mating edge connection between the first and second housing portions, an electronic component, and an electrically insulating frame. The electrically insulating frame is positioned within the enclosure and surrounds at least a portion of the electronic component thus providing an electrostatic discharge barrier between the mating edge connection and the electronic component.
1. A handheld electronic device, the device comprising:
a first and second housing portions at least partially defining an enclosure:
a mating edge connection between the first and second housing portions, wherein at least a portion of the mating edge connection comprises a gap between the first housing portion and the second housing portion;
an electronic component positioned within the enclosure; and
an electrically insulating frame positioned within the enclosure and surrounding at least a portion of the electronic component to provide an electrostatic barrier between the mating edge connection and the electronic component and wherein the electrically insulating frame is positioned adjacent to the gap between the first housing portion and the second housing portion.
2. The handheld electronic device of claim 1 , wherein at least a portion of the mating edge connection comprises a portion of the first housing position that overlaps with a portion of the second housing portion.
3. The handheld electronic device of claim 1 , wherein the electronic component comprises a circuit board.
4. The handheld electronic device of claim 3 , wherein the circuit board is at least partially supported by a groove of the electrically insulating frame.
5. A method of protecting an electronic component of an electronic device from an electrostatic discharge, the method comprising the steps of:
surrounding at least a portion of the electronic component with an insulating frame;
at least partially enclosing the electronic component and frame within a housing comprising first and second housing portions and a mating edge connection between the first and second housing portions wherein at least a portion of the mating edge connection comprises a gap between the first housing portion and the second housing portion: and
positioning the frame adjacent to the mating edge connection to provide an electrostatic discharge barrier between the mating edge connection and the electronic component and wherein the electrically insulating frame is positioned adjacent to the gap between the first housing portion and the second housing portion.
6. The method of claim 5 , further comprising overlapping an edge portion of the first housing portion with an edge portion of the second housing portion to provide the mating edge connection.
7. The method of claim 5 , further comprising supporting the electronic component with the frame.