Adjustable thickness thermal interposer and electronic package utilizing same
View Patent ↗An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer includes a compressible, resilient member (e.g., an elastomeric pad) and a plurality of thin, metallic sheets (e.g., copper foils) and the thickness thereof can be adjusted by altering the number of such foils.
1. An electronic package comprising:
a first circuitized substrate;
a first electronic component positioned on said first circuitized substrate;
a heatsink thermally coupled to said first electronic component for providing escape of heat therefrom during operation thereof; and
an adjustable thermal interposer positioned between said first electronic component and said heatsink and thermally coupled thereto for providing a thermal path for heat generated by said first electronic component to said heatsink, said thermal interposer including at least one compressible resilient member and a plurality of separable, thin, and removable metallic foil sheets placed without attachment between said heatsink and said first electronic component.
2. The electronic package of claim 1 wherein said first circuitized substrate comprises a chip carrier substrate and said first electronic component comprises a semiconductor chip.
3. The electronic package of claim 1 wherein said compressible resilient member of said at least one adjustable thermal interposer comprises an elastomeric pad.
4. The electronic package of claim 3 wherein said elastomeric pad comprises silicone rubber.
5. The electronic package of claim 1 wherein each of said plurality of separable thin, and removable metallic foil sheets of said adjustable thermal interposer comprises a copper foil.
6. The electronic package of claim 5 wherein the number of foil sheets is within the range of from about two to about twenty.
7. The electronic package of claim 1 wherein said at least one compressible resilient member is in physical contact with said heatsink and at least one of said thin, and removable metallic foil sheets is in physical contact with said first electronic component, said at least one compressible resilient member being in physical contact with another one of said separable thin, and removable metallic foil sheets.
8. The electronic package of claim 7 wherein said compressible resilient member of said at least one adjustable thermal interposer comprises an elastomeric pad and each of said plurality of separable thin, and removable metallic foil sheets of said adjustable thermal interposer comprises a copper foil.
9. The electronic package of claim 7 wherein selected ones of said plurality of separable thin, and removable metallic foil sheets is removable from said adjustable thermal interposer to vary the thickness thereof.
10. The electronic package of claim 9 further including a second circuitized substrate positioned adjacent said first circuitized substrate, a second electronic component positioned on said second circuitized substrate, and a second adjustable thermal interposer positioned between said second electronic component and said heatsink for providing a thermal path for heat generated by said second electronic component to said heatsink, said second adjustable thermal interposer including at least one compressible resilient member and a plurality of separable thin, and removable metallic foil sheets, said heatsink also being thermally coupled to said second electronic component for also providing escape of heat from said second electronic component during operation thereof.
11. The electronic package of claim 10 further including a third circuitized substrate, said third circuitized substrate having a third electronic component positioned thereon and said second circuitized substrate being positioned on said third circuitized substrate.
12. The electronic package of claim 11 wherein said third circuitized substrate comprises a printed circuit board, said third circuitized substrate and said second circuitized substrate each comprising a chip cater substrate and said second and third electronic components each comprising a semiconductor chip.
13. The electronic package of claim 1 further including a second circuitized substrate, said second circuitized substrate comprising a printed circuit board, said first circuitized substrate also comprising a chip cater substrate positioned on said second circuitized substrate and said first electronic component comprising a semiconductor chip.
14. The electronic package of claim 13 further including a housing, said printed circuit board, said first circuitized substrate, said first electronic component, said heatsink and said adjustable thermal interposer being positioned within said housing, said electronic package comprising an information handling system.
15. The electronic package of claim 14 wherein said information handling system is selected from the group of information handling systems consisting of a personal computer, computer server and computer mainframe.
16. The electronic package of claim 1 further including a second circuitized substrate, said first circuitized substrate being positioned on said second circuitized substrate, said heatsink being secured to said second circuitized substrate in such a manner so as to exert a force onto said adjustable thermal interposer.
17. An adjustable thermal interposer for use with an electronic package, said adjustable thermal interposer comprising:
at least one compressible resilient member; and
a plurality of separable, thin, and removable metallic foil sheets, at least one of said separable, thin, and removable metallic foil sheets being positioned in direct contact with said at least one compressible resilient member, each of said plurality of separable, thin, and removable metallic foil sheets being placed without attachment to a heatsink or an electronic component.
18. The adjustable thermal interposer of claim 17 wherein said compressible resilient member comprises an elastomeric pad.
19. The adjustable thermal interposer of claim 18 wherein said elastomeric pad comprises silicone rubber.