Method and apparatus for growing multiple crystalline ribbons from a single crucible
Methods and apparatus for concurrent growth of multiple crystalline ribbons from a single crucible employ meniscus shapers to facilitate continuous growth of discrete and substantially flat crystalline ribbons having controlled width.
1. A method for forming multiple semiconductor ribbons in a crucible, comprising:
disposing multiple meniscus shapers in the crucible;
forming a melt from a semiconductor material in the crucible, the multiple meniscus shapers forming a plurality of melt subregions in the crucible; and
pulling a semiconductor ribbon away from a surface of each melt subregion to form multiple semiconductor ribbons.
2. The method of claim 1 further comprising using at least one of the meniscus shapers to determine the vertical position of attachment between a surface of the melt in a particular melt subregion and a respective semiconductor ribbon growing therefrom.
3. The method of claim 1 further comprising using at least one of the multiple meniscus shapers to control the shape of a meniscus of a semiconductor ribbon.
4. The method of claim 1 wherein a first meniscus of a first semiconductor ribbon is independent of a first meniscus of a second semiconductor ribbon.
5. The method of claim 4 further comprising controlling the shape of at least one of the first meniscus and the second meniscus using the top of the respective meniscus shaper.
6. The method of claim 1 wherein a portion of at least one of the meniscus shapers extends below the surface of the melt.
7. The method of claim 1 further comprising minimizing interaction between adjacent semiconductor ribbons using the multiple meniscus shapers.
8. The method of claim 1 further comprising forming a uniform thermal profile to minimize stress on the multiple semiconductor ribbons.
9. The method of claim 1 further comprising forming the multiple semiconductor ribbons substantially concurrently.
10. The method of claim 1 further comprising forming the multiple semiconductor ribbons in a face-to-face pattern.
11. The method of claim 1 further comprising forming the multiple semiconductor ribbons in a head-to-tail pattern.
12. An apparatus for growing multiple semiconductor ribbons, comprising:
a crucible for holding a melt of a semiconductor material; and
multiple meniscus shapers disposed in the crucible to separate the melt into a plurality of melt subregions, each meniscus shaper determining in a respective melt subregion the vertical position of attachment between a surface of melt in the respective melt subregion and a semiconductor ribbon grown from the respective melt subregion.
13. The apparatus of claim 12 wherein a portion of the melt in each melt subregion is crystallized.
14. The apparatus of claim 13 wherein the semiconductor ribbon is pulled away from the melt surface from the portion of the melt crystallized.
15. The apparatus of claim 12 wherein at least one of the multiple meniscus shapers controls the shape of a respective meniscus of the respective semiconductor ribbon.
16. The apparatus of claim 12 wherein a first meniscus of a first semiconductor ribbon is independent of a second meniscus of a second semiconductor ribbon.
17. The apparatus of claim 12 wherein a portion of at least one of the meniscus shapers extends below the surface of the melt.
18. The apparatus of claim 12 further comprising a housing for isolating the melt from the ambient environment.
19. An apparatus for semiconductor ribbon growth comprising:
a crucible for holding a melt of a semiconductor material; and
a plurality of meniscus shapers disposed in the crucible to separate the melt into a plurality of melt subregions, a first melt subregion including a first melt surface defined by a first meniscus shaper and a second melt subregion including a second melt surface defined by a second meniscus shaper, the first meniscus shaper minimizing interference between a first semiconductor ribbon growing from the first melt surface and a second semiconductor ribbon growing from the second melt surface.
20. The apparatus of claim 19 wherein the first meniscus shaper determines the vertical position of attachment between the first melt surface and the first semiconductor ribbon.
21. The apparatus of claim 19 wherein a first meniscus of the first semiconductor ribbon is independent of a second meniscus of the second semiconductor ribbon.
22. The apparatus of claim 19 further comprising a housing for isolating the melt of the semiconductor material from the ambient environment.