Semiconductor package
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
1. A semiconductor package comprising:
an electrically conductive clip having an interior surface;
a dielectric body disposed over at least a portion of said interior surface of said conductive clip;
at least one I/O terminal;
a conductive pad;
a track connecting said conductive pad to said I/O terminal;
an IC having at least one pad electrically connected to said conductive pad; and
a power semiconductor device having at least one power electrode electrically and mechanically connected to another portion of said interior surface of said conductive clip wherein said IC includes a driver circuit for driving said power semiconductor device.
2. The package of claim 1 , wherein said power semiconductor device is a power MOSFET.
3. The package of claim 1 , wherein said power semiconductor device is an IGBT.
4. The package of claim 1 , wherein said conductive clip is can-shaped.
5. The package of claim 1 , wherein said conductive clip is comprised of copper.
6. The package of claim 1 , wherein said conductive clip is plated with either gold or silver.
7. The package of claim 1 , further comprising a solder resist body covering at least said track.
8. The package of claim 1 , wherein said dielectric body is comprised of a polymer.