Airflow guides using silicon walls/creating channels for heat control
An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.
1. A printed circuit board, comprising:
a board formed of first insulating material for serving as a base for a printed circuit superimposed on the board and for at least one component; and
a wall consisting of a plurality of successive second insulating material layers, a first layer of said plurality of successive second insulating material layers being a liquid which is configured to be cured on the board, the wall forming an extension of the board, wherein the wall controls airflow across the board and around the at least one component, where the airflow is generated by a system fan, substantially directed horizontally across the printed circuit board, and the airflow is directed toward another component to prevent airflow impinging upon the at least one component.
2. The printed circuit board as claimed in claim 1 , wherein the component is fixed to the board and connected to the printed circuit with solder.
3. The printed circuit board as claimed in claim 2 , wherein the wall extends over the component.
4. The printed circuit board as claimed in claim 2 , wherein the wall is deposited around the component.
5. The printed circuit board as claimed in claim 2 , further comprising another component fixed to the board.
6. The printed circuit board as claimed in claim 5 , wherein the wall is deposited between the first component and another component.
7. An electronic device, comprising:
a printed circuit board including a board formed of first insulating material for serving as a base for a printed circuit superimposed on the board;
at least one component mounted to the printed circuit board; and
a wall consisting of a plurality of successive second insulating material layers, a first layer of said plurality of successive second insulating material layers being a liquid which is configured to be cured on the board, the wall forming an extension of the board, wherein the wall controls airflow across the board and around the at least one component, where the airflow is generated by a system fan, substantially directed horizontally across the printed circuit board, and the airflow is directed toward another component to prevent airflow impinging upon the at least one component.
8. The electronic device as claimed in claim 7 , wherein the component is fixed to the board and connected to the printed circuit with solder.
9. The electronic device as claimed in claim 8 , wherein the wall is deposited around the component.
10. The electronic device as claimed in claim 8 , further comprising another component fixed to the board.
11. The electronic device as claimed in claim 10 , wherein the wall is deposited between the first component and another component.
12. An electronic device, comprising:
a housing;
a printed circuit board contained within the housing, the printed circuit board including a board formed of first insulating material for serving as a base for a printed circuit superimposed on the board;
a component mounted to the printed circuit board;
a cooling system for providing airflow for cooling components within the electronic device; and
a wall consisting of a plurality of successive second insulating material layers, a first layer of said plurality of successive second insulating material layers being a liquid which is configured to be cured on the board for forming an enclosure extending at least partially around the component, the wall forming an extension of the board, wherein the wall guides the airflow for regulating temperature in at least one of the enclosure and the housing outside of the enclosure.
13. The electronic device as claimed in claim 12 , wherein the component is fixed to the board and connected to the printed circuit with solder.
14. The electronic device as claimed in claim 13 , wherein the wall extends over the component.
15. The electronic device as claimed in claim 13 , wherein the wall is deposited around the component.
16. The electronic device as claimed in claim 12 , further comprising a second printed circuit board including a second board formed of third insulating material positioned adjacent to the wall for forming a further portion of the enclosure.
17. An electronic device, comprising:
a printed circuit board including a board formed of first insulating material for serving as a base for a printed circuit superimposed on the board;
a component mounted to the printed circuit board; and
a wall consisting of a plurality of successive second insulating material layers, a first layer of said plurality of successive second insulating material layers being a liquid which is configured to be cured on the board for forming an enclosure around the component, the wall forming an extension of the board, wherein the wall inhibits access to at least one of the printed circuit and the component.
18. The electronic device as claimed in claim 17 , wherein the component is fixed to the board and connected to the printed circuit with solder.
19. The electronic device as claimed in claim 18 , wherein the wall extends over the component.
20. The electronic device as claimed in claim 18 , wherein the wall is deposited around the component.
21. The electronic device as claimed in claim 17 , further comprising a second printed circuit board including a second board formed of third insulating material positioned adjacent to the wall for forming a further portion of the enclosure.
22. The printed circuit board as claimed in claim 1 , wherein at least one of the first insulating material or the second insulating material insulating material includes silicon.
23. The printed circuit board as claimed in claim 1 , wherein at least one of the first insulating material or the second insulating material insulating material includes fiberglass impregnated with epoxy resin.
24. The printed circuit board as claimed in claim 1 , wherein at least one of the first insulating material or the second insulating material insulating material includes plastic.
25. The printed circuit board in claim 1 , wherein at least one of the first insulating material or the second insulating material insulating material includes paper impregnated with phenolic resin.