IP Library Granted Patent US 7,839,657
Granted Patent B2
US 7,839,657 · App. 11/414,429 · Granted Nov 23, 2010

Position adjustable printed circuit board

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Quick Facts
Patent No.
US 7,839,657
App. No.
11/414,429
Granted
Nov 23, 2010
Kind
B2
Abstract

A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed to the mother board and the daughter board on a common plane the frangible connections are broken to allow the daughter board to be moved to a desired position relative to the mother board. The electrical conductors that connect the daughter board to the mother board are semi-rigid to provide movement while maintaining a desired position of the daughter board relative to the mother board.

Claims (25)

1. A method of assembling a circuit board comprising the steps of:

a) defining a daughter board within a mother board, wherein the daughter board is attached to the mother board through a frangible connection;

b) electrically connecting the daughter board to the mother board through a plurality of electrical conductors;

c) separating the daughter board from the mother board by breaking the frangible connection to the mother board; and

d) positioning the daughter board in a desired orientation spaced apart from the mother board.

2. The method as recited in claim 1 , wherein the electrical conductors comprise a bus wire having rigidity capable of supporting the daughter board in the desired orientation.

3. The method as recited in claim 1 , wherein the step of defining the daughter board includes cutting a slot into the mother board partially surrounding the daughter board such that at least some of the mother board remains attached to the daughter board.

4. The method as recited in claim 3 , wherein the separating step includes cutting away remaining portions of the mother board attached to the daughter board.

5. The method as recited in claim 1 , wherein the mother board and the daughter board are disposed within a common plane until the separating step.

6. A method of assembling a circuit board comprising the steps of:

defining a daughter board within a mother board, wherein the daughter board is attached to the mother board through a frangible connection;

electrically connecting the daughter board to the mother board through a pluralityof electrical conductors;

separating the daughter board from the mother board by breaking the frangible connection to the mother board; and

positioning the daughter board in a desired orientation spaced apart from the mother board; and

mounting the mother board within a lower housing, where the lower housing includes a support member for partially supporting the daughter board in an orientation different and separate from than the mother board.

7. The method as recited in claim 6 , including assembling an upper housing to the lower housing, where the upper housing includes a support feature abutting the daughter board for maintaining the daughter board in the orientation different than the mother board.

8. A circuit board assembly comprising:

a mother board; and

a daughter board defined by a frangible connection to the mother board; and

a plurality of electrical conductors electrically connecting the daughter board to the mother board, wherein the daughter board in supported in a desired position separate from and spaced apart from the mother board; and

a housing for holding the mother board and daughter board in a desired orientation such that the daughter board is separate and spaced apart from the mother board.

9. The assembly as recited in claim 8 , wherein the housing includes an upper part and a lower part, wherein both the upper part and lower part include a post for abutting opposite sides of the daughter board for maintaining the desired orientation of the daughter board spaced apart from the mother board.

10. The method as recited in claim 1 , wherein the daughter board is surrounded on four sides by the mother board.

11. The method as recited in claim 7 , wherein one of the support member of the lower housing and the support features of the upper housing extends through an opening in the mother board.

12. The assembly as recited in claim 8 , wherein the daughter board is surrounded on four sides by the mother board.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY SECTION BY REMOVING ERRONEOUSLY LISTED PATENT NUMBERS; PREVIOUSLY RECORDED AT REEL: 057499 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 31, 2022
From: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
To: VITESCO TECHNOLOGIES USA, LLC
Reel/Frame 059567/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2021
From: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
To: VITESCO TECHNOLOGIES USA, LLC
Reel/Frame 058108/0412 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2021
From: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
To: VITESCO TECHNOLOGIES USA, LLC
Reel/Frame 057499/0827 →
MERGER Recorded May 28, 2014
From: CONTINENTAL AUTOMOTIVE SYSTEMS US, INC.
To: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
Reel/Frame 033034/0225 →
CHANGE OF NAME Recorded Sep 2, 2010
From: SIEMENS VDO AUTOMOTIVE CORPORATION
To: CONTINENTAL AUTOMOTIVE SYSTEMS US, INC.
Reel/Frame 024952/0950 →
CHANGE OF NAME Recorded Aug 31, 2010
From: SIEMENS VDO AUTOMOTIVE CORPORATION
To: CONTINENTAL AUTOMOTIVE SYSTEMS, US, INC.
Reel/Frame 024913/0030 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2006
From: NODINE, THOMAS H.
To: SIEMENS VDO AUTOMOTIVE CORPORATION
Reel/Frame 017825/0262 →