High precision capacitor with standoff
View Patent ↗An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.
1. A capacitor, comprising:
a semiconductor substrate having first and second principal surfaces;
a dielectric layer overlaying the first principal surface of the substrate;
a first electrode;
a second electrode;
a passivation layer overlying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode;
a first bottom electrode termination in the first opening and a second bottom electrode termination in the second opening, the first bottom electrode termination being electrically connected to the first electrode and the second bottom electrode termination being electrically connected to the second electrode;
a standoff positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the capacitor when mounted to thereby provide resistance to tilting.
2. The capacitor of claim 1 wherein the standoff is configured as a strip.
3. The capacitor of claim 2 wherein the strip fully extends across the capacitor.
4. The capacitor of claim 1 wherein the standoff is configured as a dot.
5. The capacitor of claim 1 wherein the standoff is configured as a partial dot.
6. The capacitor of claim 1 wherein the capacitor is packaged in a standard 0402 size having a length of about 0.04 inches (1.02 mm) and a width of about 0.02 inches (0.51 mm).
7. The capacitor of claim 1 wherein the standoff is between 100 and 400 μm wide.
8. The capacitor of claim 1 wherein the standoff is between 50 and 200 μm thick.
9. The capacitor of claim 1 wherein the first bottom electrode termination comprises a first solder ball and the second bottom electrode termination comprises a second solder ball.
10. The capacitor of claim 1 wherein the first bottom electrode termination and the second bottom electrode termination being screen printed.
11. An electronic component, comprising:
a substrate having first and second opposite principal surfaces;
a first electrode overlaying the substrate;
a second electrode overlaying the substrate;
a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode;
a first bottom electrode termination electrically connected to the first electrode and extending beyond the first surface of the substrate;
a second bottom electrode termination electrically connected to the second electrode and extending beyond the first surface of the substrate;
a standoff positioned between the first bottom electrode termination and the second bottom electrode termination and extending beyond the first surface of the substrate to thereby provide support for the electronic component when mounted to thereby provide resistance to tilting of the electronic component.
12. The electronic component of claim 11 wherein the standoff is configured as a strip.
13. The electronic component of claim 12 wherein the strip fully extends across the capacitor.
14. The electronic component of claim 11 wherein the standoff is configured as a dot.
15. The electronic component of claim 11 wherein the standoff is configured as a partial dot.
16. The electronic component of claim 11 wherein the capacitor is packaged in a standard 0402 size having a length of about 0.04 inches (1.02 mm) and a width of about 0.02 inches (0.51 mm).
17. The electronic component of claim 11 wherein the standoff is between 100 and 400 μm wide.
18. The electronic component of claim 11 wherein the standoff is between 50 and 200 μm thick.
19. The electronic component of claim 11 wherein the first bottom electrode termination comprises a first solder ball and the second bottom electrode termination comprises a second solder ball.
20. The electronic component of claim 11 wherein the substrate is a semiconductor substrate.
21. The electronic component of claim 11 wherein the electronic component is a capacitor.
22. The electronic component of claim 11 wherein the first bottom electrode termination and the second bottom electrode termination being formed by screen printing.