Hard mask technique in forming a plug
View Patent ↗A method for manufacturing a semiconductor device includes the steps of forming a conductive hard mask coupled to the semiconductor substrate via discharge plugs on a thick insulating film, selectively etching the thick insulating film by using the conductive hard mask to form cylindrical holes in the thick insulating film. The resultant cylindrical holes are free form bowing structure.
1. A method of manufacturing a semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole; and
forming a first electrode in said cylindrical hole,
wherein said mask pattern includes a conductive material.
2. The method according to claim 1 , wherein said cylindrical hole has an aspect ratio of 14 or above.
3. The method according to claim 1 , further comprising forming an electrode plug on a bottom of said first electrode.
4. The method according to claim 1 , further comprising forming a capacitor including a top electrode, a capacitor insulation film and a bottom electrode configured by said first electrode.
5. The method according to claim 1 , wherein said semiconductor device comprises a DRAM device.
6. The method according to claim 1 , wherein said electrode plug is disposed in a chip area of a wafer or a vicinity of said chip area.
7. A method of manufacturing a semiconductor package comprising:
manufacturing first and second semiconductor devices by using the method according to claim 1 , and
stacking said first semiconductor device onto said second semiconductor device so that said electrode plug of said first semiconductor device is in contact with said electrode plug of said second semiconductor device.
8. The method according to claim 1 , wherein said forming said electrode plug comprises forming a trench using a plasma-enhanced etch and depositing a conductive film in said trench.
9. The method according to claim 1 , wherein said forming a first electrode comprises depositing a conductive film in said cylindrical hole.
10. The method according to claim 6 , wherein said forming said electrode plug comprises forming a plurality of said electrode plug arranged along a scribe area of a semiconductor wafer.
11. The method according to claim 6 , wherein said forming said electrode plug comprises forming an elongate electrode plug extending along a scribe area of a semiconductor wafer.
12. The method according to claim 8 , wherein said trench has an aspect ratio of less than 14.
13. The method according to claim 9 , further comprising forming a second electrode by depositing a second conductive film in said cylindrical hole.
14. A method of manufacturing a semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming a mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole; and
forming a first electrode in said cylindrical hole,
wherein said mask pattern is electrically coupled to said semiconductor substrate through said electrode plug.
15. A method of manufacturing a semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming a mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole; and
forming a first electrode in said cylindrical hole,
wherein the semiconductor device comprises a plurality of chip areas separated by a plurality of scribe lines, and
wherein said electrode plug is disposed along said scribe lines.
16. A method of manufacturing a semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming a mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole;
forming a first electrode in said cylindrical hole; and
heat treating said conductive film,
wherein said forming said electrode plug comprises forming a trench using a plasma-enhanced etch and depositing a conductive film in said trench.
17. A method of manufacturing a semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole; and
forming a first electrode in said cylindrical hole,
wherein said mask is patterned using orbicular-zone illumination.
18. A method of manufacturing semiconductor device comprising:
forming an insulating film overlying a semiconductor substrate;
forming an electrode plug penetrating said insulating film to reach said semiconductor substrate;
forming a mask pattern on said insulating film and on top of said electrode plug;
selectively etching said insulating film by a dry etching using said mask pattern as an etching mask to form therein a cylindrical hole; and
forming a first electrode in said cylindrical hole,
wherein said mask comprises impurity-doped silicon.