Vapor Phase Deposition System and Method

1 . A system for depositing a vapor phase organic compound onto a substrate, comprising:

a vacuum chamber comprising a wall;

a wall heater in thermal communication with the wall of the vacuum chamber;

at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and

a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.

2 . The system of claim 1 , wherein the clamping mechanism comprising a clamping member configured to contact a portion of a device of the substrate.

3 . The system of claim 2 , wherein the clamping member includes a heater.

4 . The system of claim 2 , wherein the clamping mechanism further comprises a clamping base disposed at least partially around and spaced from the cooled chuck.

5 . The system of claim 4 , wherein the clamping member and clamping base are movable relative to one another.

6 . The system of claim 4 , further comprising a seal disposed between the clamping base and the cooled chuck.

7 . The system of claim 4 , further comprising a seal coupled to the cooled chuck, wherein the seal is configured to contact the substrate when the substrate is positioned on the substrate holder.

8 . The system of claim 4 , wherein the clamping member includes at least one magnetic portion, and wherein the clamping base includes an electromagnet.

9 . The system of claim 2 , further comprising a seal coupled to the clamping member, wherein the seal is configured to contact the substrate when the substrate is positioned on the substrate holder.

10 . The system of claim 2 , wherein the clamping member includes an outer contact structure having a closed perimeter defining an open central area, and an intermediate contact positioned within the open central area.

11 . The system of claim 1 , wherein the substrate holder is positioned in a face-up orientation in the vacuum chamber.

12 . The system of claim 1 , wherein the substrate holder is positioned in a face-down orientation in the vacuum chamber.

13 . The system of claim 1 , wherein the substrate holder is positioned in a generally side-facing orientation in the vacuum chamber.

14 . A system for depositing a vapor phase organic compound onto a substrate, comprising:

a vacuum chamber comprising a wall;

a heater in thermal communication with the wall of the vacuum chamber; and

a substrate holding system disposed within the vacuum chamber, wherein the substrate holding system comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping device comprising a clamping member that operates via at least one of a mechanical and a magnetic clamping force, wherein the clamping member comprises a heating mechanism configured to heat the clamping member.

15 . The system of claim 14 , wherein the clamping device further comprises a clamping base disposed at least partially around and spaced from the cooled chuck.

16 . The system of claim 15 , wherein the clamping member and clamping base are movable relative to one another.

17 . The system of claim 14 , further comprising a seal disposed between the clamping base and the cooled chuck.

18 . The system of claim 14 , further comprising a seal coupled to the cooled chuck, wherein the seal is configured to contact the substrate when the substrate is positioned on the substrate holder.

19 . The system of claim 14 , wherein the clamping member comprises a magnetic portion, and wherein the clamping base includes an electromagnet.

20 . The system of claim 1 , further comprising a seal coupled to the clamping member, wherein the seal is configured to contact the substrate when the substrate is positioned on the substrate holder.

21 . The system of claim 1 , wherein the substrate holder is positioned in a face-down orientation in the vacuum chamber.

22 . In an OLED manufacturing process, a method of depositing a vapor phase organic compound onto a substrate in a deposition chamber, the deposition chamber comprising a wall, the method comprising:

forming a vacuum in the chamber;

cooling the substrate to a temperature below a boiling point of the organic compound;

heating the wall of the deposition chamber to a temperature above the boiling point of the organic compound; and

introducing a vapor of the organic compound into the deposition chamber.

23 . The method of claim 22 , wherein cooling the substrate includes cooling the substrate to a temperature of approximately 20 degrees Celsius to −40 degrees Celsius.

24 . The method of claim 22 , wherein heating the wall of the deposition chamber includes heating the wall of the deposition chamber to a temperature of approximately 20-65 degrees Celsius.

25 . The method of claim 22 , wherein the organic compound comprises a parylene-based reactive intermediate compound.

26 . The method of claim 25 , wherein the parylene-based reactive intermediate compound comprises *CF 2 C 6 H 4 CF 2 *, wherein * denotes a free radical.

27 . The method of claim 22 , further comprising clamping the substrate to a cooled substrate holder via a mechanical clamp.

28 . The method of claim 27 , further comprising heating the mechanical clamp while cooling the substrate.

29 . The method of claim 28 , wherein heating the mechanical clamp includes heating the mechanical clamp to a temperature of approximately 20-65 degrees Celsius.

30 . The method of claim 27 , wherein the cooled substrate holder includes a cooled chuck, further comprising adding a heat exchange fluid to a space between the substrate and a cooled chuck of the substrate holder.

31 . The method of claim 30 , wherein the heat exchange fluid is helium gas, and wherein the helium gas is added to the space between the substrate and the cooled chuck at a pressure of approximately 3 Torr or greater.

32 . The method of claim 22 , further comprising clamping the substrate to a cooled substrate holder via a magnetic clamp.

33 . The method of claim 22 , further comprising clamping the substrate to a cooled holder via an electrostatic mechanism.