Substrate Holder
A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.
1 . A substrate holder for holding and cooling a substrate during a film deposition process, comprising:
a cooled chuck; and
a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.
2 . The substrate holder of claim 1 , further comprising a clamping base positioned adjacent to and spaced from the cooled chuck, wherein the clamping base includes a clamping surface having a seal.
3 . The substrate holder of claim 2 , wherein the clamping base is spaced from the cooled chuck via a thermally insulating spacer.
4 . The substrate holder of claim 2 , wherein the clamping base is made at least partially of a material having a lower thermal conductivity than the clamping member.
5 . The substrate holder of claim 1 , wherein the clamping member comprises a magnetic material, and further comprising an electromagnet configured to attract the clamping member toward the cooled chuck via the magnetic material.
6 . The substrate holder of claim 1 , wherein the clamping member comprises a magnetic material, and further comprising a permanent magnet configured to attract the clamping member toward the cooled chuck via the magnetic material.
7 . The substrate holder of claim 1 , wherein the clamping member is configured to mechanically clamp the substrate adjacent to the cooled chuck.
8 . The substrate holder of claim 1 , wherein the clamping member comprises a thermally insulating substrate contact.
9 . The substrate holder of claim 1 , wherein the clamping member comprises a perimeter substrate contact and an intermediate substrate contact, wherein the intermediate substrate contact is positioned within an area defined by the perimeter substrate contact.
10 . The substrate holder of claim 9 , further comprising a plurality of intermediate contacts.
11 . The substrate holder of claim 1 , wherein the clamping member comprises a substrate-holding recess.
12 . The substrate holder of claim 1 , further comprising a heater in thermal communication with the clamping member.
13 . The substrate holder of claim 12 , wherein the heater comprises a resistive element integrated into the clamping member.
14 . The substrate holder of claim 1 , further comprising a heat transfer gas outlet in fluid communication with an upper surface of the cooled chuck, and a seal configured to be contacted by the substrate when the clamping member is in the closed position to seal a heat transfer gas in the space between the substrate and the cooled chuck.
15 . A substrate holder for holding and cooling a substrate during a film deposition process, comprising:
a cooled chuck;
a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck; and
a heater in thermal communication with the clamping member.
16 . The substrate holder of claim 15 , further comprising a clamping base positioned adjacent to and spaced from the cooled chuck.
17 . The substrate holder of claim 16 , wherein the clamping base is spaced from the cooled chuck via a thermally insulating spacer.
18 . The substrate holder of claim 16 , wherein the clamping base comprises a thermally insulating substrate seal.
19 . The substrate holder of claim 16 , wherein the clamping member is configured to exert a mechanical clamping force to clamp the substrate between the clamping member and the clamping base.
20 . The substrate holder of claim 15 , wherein the clamping member comprises a magnetic material, and further comprising an electromagnet configured to attract the clamping member generally toward the cooled chuck.
21 . The substrate holder of claim 15 , wherein the clamping member comprises a magnetic material, and further comprising a permanent magnet configured to attract the clamping member generally toward the cooled chuck.
22 . The substrate holder of claim 15 , wherein the clamping member comprises a perimeter substrate contact and an intermediate substrate contact, wherein the intermediate substrate contact is positioned within an inner area defined by the perimeter substrate contact.
23 . The substrate holder of claim 15 , wherein the heater comprises a resistive element integrated into the clamping member.
24 . A substrate holder for holding and cooling a substrate during a film deposition process, comprising
a cooled chuck;
a clamping base;
a movable clamping member configured to exert a mechanical clamping force to hold the substrate between the clamping base and the clamping member in a position adjacent to the cooled chuck; and
a heater in thermal communication with the clamping member.
25 . The substrate holder of claim 24 , wherein the clamping base is positioned substantially around the cooled chuck and is spaced from the cooled chuck.
26 . The substrate holder of claim 24 , wherein the clamping member comprises a thermally insulating substrate contact.
27 . The substrate holder of claim 24 , wherein the clamping member comprises a perimeter clamping portion and an intermediate substrate contact, wherein the intermediate substrate contact is positioned within an inner area defined by the perimeter substrate contact.
28 . The substrate holder of claim 24 , wherein the heater includes a heating element integrated into the clamping member.
29 . A substrate holder for holding and cooling a substrate during a film deposition process, comprising
a cooled chuck comprising a magnet;
a movable clamping member movable between an unclamped position and a clamped position in which the substrate is held between the clamping base and the clamping member in a position adjacent to the cooled chuck, wherein the clamping member comprises a magnetic material; and
a heater in thermal communication with the clamping member.
30 . The substrate holder of claim 29 , wherein the magnet is a permanent magnet.
31 . The substrate holder of claim 29 , wherein the magnet is an electromagnet.
32 . The substrate holder of claim 29 , wherein the clamping member comprises a perimeter clamping portion and an intermediate substrate contact, wherein the intermediate substrate contact is positioned within an inner area defined by the perimeter substrate contact.
33 . The substrate holder of claim 32 , wherein the cooled chuck further comprises an intermediate magnet configured to attract the intermediate substrate contact.