IP Library Granted Patent US 7,345,916
Granted Patent B2
US 7,345,916 · App. 11/423,638 · Granted Mar 18, 2008

Method and apparatus for high voltage operation for a high performance semiconductor memory device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,345,916
App. No.
11/423,638
Granted
Mar 18, 2008
Kind
B2
Abstract

A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells ( 200 ) of a semiconductor memory device ( 100 ). A high voltage generator ( 106 ) during program or erase operations provides a continuous high voltage level ( 702 ) on selected word lines ( 502 ) and maintains a continuous high voltage level supply to a bit line decoder ( 120 ) which sequentially provides the high voltage level ( 706 ) to a first portion of bit lines ( 504 ) and discharges ( 708 ) those bit lines ( 504 ) before providing the high voltage level to a second portion ( 710 ). For additional improvements to program operations, the high voltage generator ( 106 ) decouples high voltages provided to the word lines ( 502 ) and the bit lines ( 504 ) by providing a current flow control device ( 1208 ) therebetween and provides a boosting voltage at a time ( 1104 ) to overcome a voltage level drop ( 1102 ) resulting from a capacitor load associated with selected bit lines ( 504 ) and/or the bit line decoder ( 120 ) precharges ( 1716 ) a second portion of the bit lines ( 504 ) while providing a high voltage level to a first portion to program ( 1706 ) a first portion of memory cells ( 200 ). For improvements to read operations, whether dynamic reference cells ( 2002 ) are blank is determined by providing non-identically regulated high voltage levels from a first voltage source ( 2112 ) to the dynamic reference cells ( 2002 ) and from a second voltage source ( 2104 ) to static reference cells ( 2004 ) and, if the dynamic reference cells ( 2002 ) are not blank, reads selected memory cells ( 200 ) by providing identically regulated high voltage levels to the selected memory cells ( 200 ), the dynamic reference cells ( 2002 ) and the static reference cells ( 2004 ).

Claims (20)

1. A method for high voltage programming on selected memory cells of a semiconductor memory device comprising a memory cell array comprising a plurality of memory cells including the selected memory cells, each of said plurality of memory cells accessed by one of a plurality of word lines and one of a plurality of bit lines, the method comprising the steps of:

providing a high voltage level to a first portion of the plurality of bit lines for a predetermined time interval to program a first portion of the selected memory cells;

precharging a second portion of the plurality of bit lines during the predetermined time interval that the high voltage level is provided to the first portion of the plurality of bit lines; and

thereafter providing the high voltage level to the second portion of the plurality of bit lines for the predetermined time interval to program the second portion of the selected memory cells.

2. The method of claim 1 further comprising the step of discharging the first portion of the plurality of bit lines during the predetermined time interval that the high voltage level is provided to the second portion of the plurality of bit lines.

3. The method of claim 1 further comprising the step of providing a continuous high voltage level on selected ones of the plurality of word lines to the selected memory cells for the predetermined time interval to program the first and the second portions of the selected memory cells.

4. The method of claim 1 wherein the step of precharging the second portion of the plurality of bit lines comprises the step of precharging the second portion of the plurality of bit lines to a voltage level less than the high voltage level.

5. The method of claim 4 wherein the step of providing the high voltage level to the second portion of the plurality of bit lines comprises the step of, during the predetermined time interval, further charging the second portion of the plurality of bit lines from the voltage level less than the high voltage level to the high voltage level and thereafter providing the high voltage level to the second portion of the plurality of bit lines.

6. The method of claim 1 wherein the semiconductor memory device comprises a bit line decoder comprising a plurality of data block decoders, each of the plurality of data block decoders coupled to a corresponding one of the plurality of bit lines, and wherein the step of providing the high voltage level to the first portion of the plurality of bit lines for the predetermined time interval comprises the step of providing the high voltage level to a portion of the plurality of data block decoders performing substantially equivalent decoding of the corresponding ones of the plurality of bit lines.

7. A semiconductor memory device comprising:

a memory cell array comprising a plurality of memory cells including selected memory cells for performing high voltage operations thereon;

a plurality of word lines, each of the plurality of word lines coupled to one or more of the plurality of memory cells for access thereof;

a plurality of bit lines, each of the plurality of bit lines coupled to one or more of the plurality of memory cells for access thereof;

a high voltage generator coupled to the plurality of word lines and the plurality of bit lines for generating a high voltage level to the plurality of word lines and the plurality of bit lines; and

a bit line decoder coupled to the high voltage generator and the plurality of bit lines for controlling the provision of high voltage to selected ones of the plurality of bit lines for high voltage operation of selected memory cells, the bit line decoder providing a high voltage level to a first portion of the plurality of bit lines for a predetermined time interval to program a first portion of the selected memory cells, precharging a second portion of the plurality of bit lines during the predetermined time interval that the high voltage level is provided to the first portion of the plurality of bit lines, and thereafter providing the high voltage level to the second portion of the plurality of bit lines for the predetermined time interval to program a second portion of the selected memory cells.

8. The semiconductor memory device of claim 7 wherein the bit line decoder further discharges the first portion of the plurality of bit lines during the predetermined time interval that the high voltage level is provided to the second portion of the plurality of bit lines.

9. The semiconductor memory device of claim 7 further comprising a word line decoder coupled to the high voltage generator and providing a continuous high voltage level on selected ones of the plurality of word lines to the selected memory cells for the predetermined time interval to program the first and the second portions of the selected memory cells.

10. The semiconductor memory device of claim 7 wherein the bit line decoder precharges the second portion of the plurality of bit lines to a voltage level less than the high voltage level.

11. The semiconductor memory device of claim 10 wherein the bit line decoder, during the predetermined time interval, further charges the second portion of the plurality of bit lines from the voltage level less than the high voltage level to the high voltage level and thereafter provides the high voltage level to the second portion of the plurality of bit lines.

12. The semiconductor memory device of claim 7 wherein the bit line decoder comprises a plurality of data block decoders, each of the plurality of data block decoders coupled to a corresponding one of the plurality of bit lines, and wherein the step of providing the high voltage level to the first portion of the plurality of bit lines for the predetermined time interval comprises the step of providing the high voltage level to a portion of the plurality of data block decoders performing substantially equivalent decoding of the corresponding ones of the plurality of bit lines.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036037/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2006
From: YANG, NIAN; ANG, BOON-AIK; WU, YONGGANG; WANG, GUOWEI; LAI, FAN WAN
To: SPANSION LLC
Reel/Frame 017778/0600 →