Method of manufacturing a vertically-structured GaN-based light emitting diode
View Patent ↗The present invention relates to a method of manufacturing a vertically-structured GaN-based light emitting diode. The method of manufacturing a vertically-structured GaN-based light emitting diode includes forming a GaN layer on a substrate; patterning the compound layer in a predetermined shape; forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer; sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer; removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
1. A method of manufacturing a vertically-structured GaN-based light emitting diode comprising:
forming a GaN layer on a substrate;
forming a compound layer on the GaN layer in order to perform an epitaxial lateral over-growth (ELOG) process;
patterning the compound layer in a predetermined shape;
forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer;
sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer;
removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and
forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
2. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 further including forming a p-type electrode on the p-type GaN layer after forming the p-type GaN layer.
3. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 further including forming a p-type electrode on the structure supporting layer after forming the structure supporting layer.
4. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 , wherein the structure supporting layer is formed of any one selected from a group composed of a substrate and a plated layer.
5. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 , wherein the compound layer is formed of any one compound selected from a compound group composed of SiO 2 and SiN x (silicon-nitride type).
6. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 , wherein patterning the compound layer includes:
forming a pattern layer patterned in a predetermined shape on the compound layer; and etching the compound layer by using the pattern layer as a mask.
7. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 6 , wherein forming the pattern layer includes:
forming photoresist patterns with a predetermined shape on the compound layer; and
re-flowing the photoresist patterns so as to form photoresist patterns with a hemispheric shape.
8. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 7 , wherein, in etching the compound layer, the re-flowed photoresist patterns and the compound layer are etched together, so that the compound layer is patterned in a hemispheric shape.
9. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 7 or 8 , wherein the hemispheric patterns are formed such that the height thereof ranges from 0.1 to 5 μm, the diameter thereof ranges from 0.5 to 5 μm, and the pattern period thereof ranges from 0.1 to 5 μm.
10. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 6 further including removing the pattern layer after etching the compound layer.
11. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 1 , wherein forming the n-type GaN layer includes:
forming a undoped GaN layer on the patterned compound layer; and forming a GaN layer doped with n-type impurities on the undoped GaN layer.
12. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 11 , wherein forming the GaN layer doped with n-type impurities is performed by growing the GaN layer on the undoped GaN layer while gradually increasing the doping concentration of the n-type impurities.
13. The method of manufacturing a vertically-structured GaN-based light emitting diode according to claim 11 , wherein the undoped GaN layer is formed to have a thickness of 0.1 to 1 μm.