IP Library Granted Patent US 7,289,361
Granted Patent B2
US 7,289,361 · App. 11/432,507 · Granted Oct 30, 2007

Semiconductor integrated circuit and nonvolatile memory element

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Quick Facts
Patent No.
US 7,289,361
App. No.
11/432,507
Granted
Oct 30, 2007
Kind
B2
Abstract

A semiconductor integrated circuit device is provided on a semiconductor substrate, and includes a plurality of word lines, a plurality of data lines, and a plurality of electrically programmable and erasable non-volatile memory cells respectively coupled to the plurality of word lines and to the plurality of data lines. The erasable non-volatile memory cell each includes a MIS transistor having a floating gate having a first level polycrystalline silicon layer, a source, and a drain coupled to the corresponding data line, and a control gate formed of a semiconductor region in the semiconductor substrate, the control gate being coupled to the corresponding word line.

Claims (16)

1. A semiconductor integrated circuit device on a semiconductor substrate, comprising:

a plurality of word lines;

a plurality of data lines; and

a plurality of electrically programmable and erasable non-volatile memory cells coupled to the plurality of word lines and to the plurality of data lines so that each electrically programmable and erasable non-volatile memory cell is coupled to one of the word lines and to one of the data lines, each electrically programmable and erasable non-volatile memory cell comprising:

a MIS transistor having a floating gate of a first level polycrystalline silicon layer, a source, and a drain coupled to the corresponding data line, and

control means for controlling programming and erasing of the electrically programmable and erasable non-volatile memory cells, said control means being comprised of a semiconductor region in the semiconductor substrate, the control means being coupled to the corresponding word line.

2. A semiconductor integrated circuit device according to claim 1 , further comprising:

a volatile memory coupled to receive data stored in at least one of the electrically programmable and erasable non-volatile memory cells.

3. A semiconductor integrated circuit device on a semiconductor substrate, comprising:

a plurality of word lines;

a plurality of data lines; and

a plurality of electrically programmable and erasable non-volatile memory cells coupled to the plurality of word lines and to the plurality of data lines so that each electrically programmable and erasable non-volatile memory cell is coupled to one of the word lines and to one of the data lines, each electrically programmable and erasable non-volatile memory cell comprising a pair of memory elements each of which includes:

a MIS transistor having a floating gate comprised of a first level polycrystalline silicon layer, a source, and a drain coupled to the corresponding data line, and

control means for controlling programming and erasing of the electrically programmable and erasable non-volatile memory cells, said control means being comprised of a semiconductor region in the semiconductor substrate, the control means being coupled to the corresponding word line.

4. A semiconductor integrated circuit device according to claim 3 , further comprising:

a volatile memory coupled to receive data stored in at least one of the electrically programmable and erasable non-volatile memory cells.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →