Solid state imaging device and solid state imaging element
Each of three light receiving sections has a P-type well having a P + -type layer and an N-type layer formed therein. The P + -type layer is diffused from substrate surface to depth d 1 . A PN junction forming portion of the N-type layer is diffused from depth d 1 to depth d 2 which is greater than depth d 1 so as to form, with the P-type well, a PN junction of a photodiode at depth d 2 . Depths d 1 as well as depths d 2 of the three light receiving sections are different from each other. The N-type layer has a charge output portion which is diffused from the PN junction to the substrate surface, and which is coupled by circuit coupling to a MOS transistor for reading out charge. This allows each light receiving section to have spectral characteristics, thereby providing a solid state imaging element and a solid state imaging device without using color filters.
1. A solid state imaging device comprising:
a plurality of kinds of light receiving sections for photoelectrically converting incident light to generate charge;
a transmission section for reading out the charge, and for outputting, based on the charge, a first signal group from the plurality of kinds of light receiving sections; and
a signal processing unit for generating a second signal group of a predetermined color system from the first signal group,
wherein each of the plurality of kinds of light receiving sections comprises:
a first semiconductor layer of a first conduction type having a first portion diffused from a substrate surface to a first depth in a semiconductor substrate;
a second semiconductor layer of a second conduction type having a PN junction-forming portion which is in contact with the first portion of the first semiconductor layer at the first depth, and which is diffused from the first depth to a second depth greater than the first depth, and further which forms a PN junction of a photodiode at the second depth in the semiconductor substrate; and
a third semiconductor layer of the first conduction type for forming the PN junction at the second depth with the PN junction-forming portion of the second semiconductor layer,
wherein the first semiconductor layer has a higher impurity concentration than that the third semiconductor layer, and
wherein the plurality of kinds of light receiving sections are different in the first depth and the second depth in the semiconductor substrate.
2. The solid state imaging device according to claim 1 ,
wherein the transmission section includes a MOS transistor formed in each of the light receiving sections for reading out the charge, and
wherein the second semiconductor layer further has a charge output portion diffused from the PN junction to the substrate surface and coupled by circuit coupling to the MOS transistor for outputting the charge to the transmission section.
3. The solid state imaging device according to claim 1 ,
wherein the transmission section includes a MOS transistor formed in each of the light receiving sections for reading out the charge,
wherein the second semiconductor layer further has a charge output portion which is diffused from the PN junction to a third depth smaller than the first depth in the semiconductor substrate, and which is coupled by circuit coupling to the MOS transistor for outputting the charge to the transmission section, and
wherein the first semiconductor layer further has a second portion which is diffused from the substrate surface to the third depth, and which is in contact with the charge output portion of the second semiconductor layer at the third depth.
4. The solid state imaging device according to claim 3 ,
wherein the first semiconductor layer is formed of:
a third portion which is a portion of the first portion from the third depth to the first depth; and
a fourth portion which is formed of the second portion and a portion of the first portion from the substrate surface to the third depth,
wherein the impurity concentrations of the third portion and the fourth portion are set to be different from each other.
5. The solid state imaging device according to claim 4 , wherein the number of the plurality of kinds of light receiving sections is greater than the number of colors of the predetermined color system.
6. The solid state imaging device according to claim 1 , wherein the number of the plurality of kinds of light receiving sections is greater than the number of colors of the predetermined color system.
7. The solid state imaging device according to claim 6 , wherein the greater the second depth of each of the plurality of kinds of light receiving sections is, the larger a light receiving area of each of the plurality of kinds of light receiving sections is.
8. The solid state imaging device according to claim 7 , wherein the larger a light receiving area of each of the plurality of kinds of light receiving sections is, the larger an area of the PN junction of the photodiode in each of the plurality of kinds of light receiving sections is.
9. The solid state imaging device according to claim 1 , wherein the greater the second depth of each of the plurality of kinds of light receiving sections is, the larger a light receiving area of each of the plurality of kinds of light receiving section is.
10. The solid state imaging device according to claim 9 , wherein the larger a light receiving area of each of the plurality of kinds of light receiving sections is, the larger an area of the PN junction of the photodiode in each of the plurality of kinds of light receiving sections is.
11. A solid state imaging device comprising: a plurality of kinds of light receiving sections for photoelectrically converting incident light to generate charge;
a transmission section including a MOS transistor for reading out the charge and an amplifier for amplifying the read out charge, which are provided in each of the light receiving sections, so as to output the amplified charge as a first signal group from the plurality of kinds of light receiving sections; and
a signal processing unit for generating a second signal group of a predetermined color system from the first signal group,
wherein each of the plurality of kinds of light receiving sections comprises:
a first semiconductor layer of a first conduction type having a first portion diffused from a substrate surface to a first depth in a semiconductor substrate;
a second semiconductor layer of a second conduction type having (i) a PN junction-forming portion which is in contact with the first portion of the first semiconductor layer at the first depth, and which is diffused from the first depth to a second depth greater than the first depth, and further which forms a PN junction of a photodiode at the second depth in the semiconductor substrate, and (ii) a charge output portion diffused from the PN junction to the substrate surface and coupled by circuit coupling to the MOS transistor for outputting the charge to the transmission section; and
a third semiconductor layer of the first conduction type for forming the PN junction at the second depth with the PN junction-forming portion of the second semiconductor layer,
wherein the first semiconductor layer has a higher impurity concentration that the third semiconductor layer, and
wherein the plurality of kinds of light receiving sections are different in the first depth and the second depth in the semiconductor substrate.
12. A solid state imaging element comprising a plurality of kinds of light receiving sections for photoelectrically converting incident light to generate charge, each of the light receiving sections comprising:
a first semiconductor layer of a first conduction type having a first portion diffused from a substrate surface to a first depth in a semiconductor substrate;
a second semiconductor layer of a second conduction type having a PN junction-forming portion which is in contact with the first portion of the first semiconductor layer at the first depth, and which is diffused from the first depth to a second depth greater than the first depth, and further which forms a PN junction of a photodiode at the second depth in the semiconductor substrate; and
a third semiconductor layer of the first conduction type for forming the PN junction at the second depth with the PN junction-forming portion of the second semiconductor layer,
wherein the first semiconductor layer has a higher impurity concentration that the third semiconductor layer, and
wherein the plurality of kinds of light receiving sections are different in the first depth and the second depth in the semiconductor substrate.