Side-emitting LED package and manufacturing method of the same
View Patent ↗The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
1. A manufacturing method of an LED package for emitting light from a light source sideward, the method comprising steps of:
(i) providing a substrate with electrodes formed thereon;
(ii) disposing light sources on the substrate;
(iii) forming a molded part on the substrate and the light sources disposed on the substrate;
(iv) dicing the molded part to divide into individual packaging parts;
(v) forming a reflective layer covering an outer surface of the molded part; and
(vi) dicing one side of the molded part and the reflective layer to form a light transmitting surface in one side.
2. The side-emitting LED package according to claim 1 , wherein the step (i) of providing a substrate comprises forming solder resistors on the substrate between areas where the light sources are to be disposed, thereby to form insulation between the reflective layer and the electrodes.
3. The method according to claim 1 , wherein the step (iii) of forming a molded part comprises transfer molding of transparent Epoxy Molding Compound (EMC) containing phosphor.
4. The method according to claim 1 , wherein step (v) of forming a reflective layer comprises depositing or plating metal selected from a group consisting of Al, Au, Ag, Ni, W, Ti and Pt.
5. The method according to claim 1 , wherein step (v) of forming a reflective layer comprises attaching a high reflectivity film on the molded part.
6. The method according to claim 1 , wherein step (vi) of forming a light transmitting surface comprises cutting the molded part such that at least one LED chip is disposed inside the molded part to form a corresponding one of the light sources.
7. The method according to claim 1 , wherein step (vi) of forming a light transmitting surface comprises cutting the molded part and the reflective layer in a direction perpendicular to a plane where the light sources are disposed.
8. The method according to claim 7 , wherein step (vi) of forming a light transmitting surface includes cutting the substrate into individual LED packages.