Method and apparatus for a low thermal impedance printed circuit board assembly
A low thermal impedance printed circuit board assembly compatible with surface mount assembly reflow solder processes is presented. The low thermal impedance printed circuit board assembly may have filled vias soldered directly to solder balls of the surface mount assembly.
1 . A low thermal impedance printed circuit board assembly comprising:
a printed circuit board with a top side and a bottom side, having a multitude of vias therein;
a surface mount device package having more than one solder ball attached to a top side of the printed circuit board;
wherein the more than one solder ball attached to the top side of the printed circuit board are attached directly to filled vias in the printed circuit board.
2 . The low thermal impedance printed circuit board assembly according to claim 1 , wherein the filled vias are filled with a copper epoxy.
3 . The low thermal impedance printed circuit board assembly according to claim 1 , wherein the filled vias are filled with a silver epoxy.
4 . The low thermal impedance printed circuit board assembly according to claim 1 , wherein the filled vias are filled with printed circuit board resin.
5 . The low thermal impedance printed circuit board assembly according to claim 1 , wherein the filled vias are planarized with the top surface of the printed circuit board.
6 . The low thermal impedance printed circuit board assembly according to claim 5 , wherein the planarized filled vias are capped.
7 . The low thermal impedance printed circuit board assembly according to claim 6 , wherein the planarized filled vias are capped with a material containing copper, nickel or gold.
8 . A method for providing a low thermal impedance printed circuit board assembly comprising:
Providing a printed circuit board with via holes;
Filling the via holes with a thermally conductive material;
Attaching a surface mount device package with solder balls to the filled via holes; and
Reflowing the solder to attach the surface mount device package to the printed circuit board.
9 . The method of providing a low thermal impedance printed circuit board assembly according to claim 8 , wherein the via holes are filled with a copper epoxy material.
10 . The method of providing a low thermal impedance printed circuit board assembly according to claim 8 , further comprising capping the filled vias.
11 . The method of providing a low thermal impedance printed circuit board assembly according to claim 10 , wherein capping the filled vias comprises plating the filled vias with copper, nickel or gold.
12 . The method of providing a low thermal impedance printed circuit board assembly according to claim 8 , further comprising the step of planarizing the filled via hole with the surface of the printed circuit board.
13 . The method of providing a low thermal impedance printed circuit board assembly according to claim 8 , wherein the step of planarizing the surface of the printed circuit board comprises a chemical etch process.
14 . The method of providing a low thermal impedance printed circuit board assembly according to claim 13 , wherein the step of planarizing the surface of the printed circuit board further comprises a sanding operation.