IP Library Granted Patent US 7,826,505
Granted Patent B2
US 7,826,505 · App. 11/445,220 · Granted Nov 2, 2010

III-V group GaN-based compound semiconductor device

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Quick Facts
Patent No.
US 7,826,505
App. No.
11/445,220
Granted
Nov 2, 2010
Kind
B2
Abstract

A III-V Group GaN-based compound semiconductor device with an improved structure having low current comsumption, high optical output, and a long lifetime is provided. The III-V Group GaN-based compound semiconductor device includes an active layer and a first clad layer and a second clad layer, wherein at least one of the first clad layer and the second clad layer has a superlattice structure formed of a plurality of alternating Al x Ga (1-x) N layers (0<x<1) and GaN layers, and the composition ratio of aluminum of the Al x Ga (1-x) N layers decreases at a predetermined rate away from the active layer.

Claims (20)

1. A III-V Group GaN-based compound semiconductor device comprising:

an active layer; and

a first clad layer and a second clad layer,

wherein at least one of the first clad layer and the second clad layer has a superlattice structure formed of a plurality of alternating AlxGa(1-x)N layers (0<x<1) and GaN layers, and the composition ratio of aluminum of the AlxGa(1-x)N layers decreases at a predetermined rate according to an increase in the distance of the AlxGa(1-x) N layers away from the active layer, and each of the AlxGa(1-x)N layers has a uniform aluminum concentration throughout the layer,

wherein an energy level of a conduction band edge of the AlxGa(1-x)N layer closest to the active layer is the highest among the AlxGa(1-x)N layers, and an energy level of a conduction band edge of the AlxGa(1-x)N layer farthest from the active layer is the lowest among the AlxGa(1-x)N layers, and

wherein the composition ratio of aluminum in the AlxGa(1-x)N layers decreases at a rate of 1.3% or less.

2. The III-V Group GaN-based compound semiconductor device of claim 1 , wherein, the composition ratios of aluminum of the AlxGa(1-x)N layers decreases gradually at a predetermined rate away from the active layer and the thicknesses of the AlxGa(1-x)N layer increases gradually away from the active layer.

3. The III-V Group GaN-based compound semiconductor device of claim 1 , wherein the composition ratios of aluminum of the AlxGa(1-x)N layers decreases gradually at a predetermined rate away from the active layer and the thicknesses of the GaN layers gradually increases away from the active layer.

4. The III-V Group GaN-based compound semiconductor device of claim 1 , wherein the composition ratios of aluminum of the AlxGa(1-x)N layers are a predetermined value or less, and the AlxGa(1-x)N layer is doped with p-type or n-type impurities.

5. The III-V Group GaN-based compound semiconductor device of claim 1 , wherein the AlxGa(1-x)N layer is doped with p-type or n-type impurities.

6. A III-V Group GaN-based compound semiconductor device comprising:

an active layer; and

a first clad layer and a second clad layer,

wherein at least one of the first clad layer and the second clad layer has a superlattice structure formed of a plurality of alternating AlxGa(1-x)N layers (0<x<1) and AlyGa(1-y)N layers (0<y<1), and, the composition ratios of aluminum of the AlxGa(1-x)N layers and AlyGa(1-y)N layers decrease at a predetermined rate according to an increase in the distance of the AlxGa(1-x)N layers and AlyGa(1-y)N layers away from the active layer, and each of the AlxGa(1-x)N layers has a uniform aluminum concentration throughout the layer,

wherein an energy level of a conduction band edge of the AlxGa(1-x)N layer closest to the active layer is the highest among the AlxGa(1-x)N layers, and an energy level of a conduction band edge of the AlxGa(1-x)N layer farthest from the active layer is the lowest among the AlxGa(1-x)N layers, and

wherein the composition ratio of aluminum in the AlxGa(1-x)N layers decreases at a rate of 1.3% or less.

7. The III-V Group GaN-based compound semiconductor device of claim 6 , wherein the composition ratios of aluminum of the AlxGa(1-x)N layers and the AlyGa(1-y)N layers decrease gradually at a predetermined rate away from the active layer, and the thicknesses of the AlxGa(1-x)N layers increase gradually away from the active layer.

8. The III-V Group GaN-based compound semiconductor device of claim 6 , wherein, the composition ratios of aluminum of the AlxGa(1-x)N layers and the AlyGa(1-y)N layers decreases gradually at a predetermined rate away from the active layer, and the thicknesses of the AlyGa(1-y)N layers increase gradually away from the active layer.

9. The III-V Group GaN-based compound semiconductor device of claim 6 , wherein the composition ratios of aluminum of the AlxGa(1-x)N layers are a predetermined value or less, and the AlxGa(1-x)N layer is doped with p-type or n-type impurities.

10. The III-V Group GaN-based compound semiconductor device of claim 6 , wherein the composition ratios of aluminum of the AlyGa(1-y)N layers are a predetermined value or less, and the AlyGa(1-y)N layer is doped with p-type or n-type impurities.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2010
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024239/0782 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2006
From: SON, JOONG-KON; HA, KYOUNG-HO; RYU, HAN-YOUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017966/0361 →