IP Library Granted Patent US 7,411,190
Granted Patent B2
US 7,411,190 · App. 11/450,459 · Granted Aug 12, 2008

Inspection system, inspection method, and process management method

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Quick Facts
Patent No.
US 7,411,190
App. No.
11/450,459
Granted
Aug 12, 2008
Kind
B2
Abstract

An inspection apparatus comprising an electron emitting unit for sequentially emitting an electron beam in the direction of an inspection area of a sample; a deceleration unit for drawing back the electron beam in the vicinity of the inspection area; an imaging unit for forming images of the drawing back electron beam on multiple different image forming conditions; an image detecting unit for capturing the electron beam that formed an image corresponding to each image forming condition; and an image processing unit for comparing the images on different image forming conditions with one another to detect a defect in the inspection area.

Claims (17)

1. An inspection apparatus comprising:

a sample stage that mounts a sample to be inspected;

an electron optical system which directs electrons to the sample;

a power supply capable of applying a voltage to the sample stage thereby to draw back the electron beam incident on the sample;

an imaging optical system that detects images of the drawn back electron beam with a plurality of image forming conditions; and

an image processing unit that calculates a difference image of images obtained with the plurality of image forming conditions;

wherein the sample is inspected based on the difference image.

2. An inspection apparatus according to claim 1 ,

wherein the imaging optical system includes a plurality of detecting planes of the drawn back electron beam.

3. An inspection apparatus according to claim 1 , further comprising:

a database that stores the difference image.

4. An inspection apparatus according to claim 1 ,

wherein the difference image is calculated as a two-dimensional brightness map.

5. An inspection apparatus according to claim 1 ,

wherein images with the plurality of image forming conditions are obtained by detecting the drawn back electron beam with different focusing conditions.

6. An inspection apparatus according to claim 5 ,

wherein the imaging optical system includes a variable-focus lens composed of electrostatic lenses.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →