Strain-inducing semiconductor regions
View Patent ↗A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.
1. A semiconductor device comprising:
a substrate having a channel region comprising a first crystalline lattice; and
a pair of source and drain regions disposed in said substrate and comprising a second crystalline lattice directly adjacent to said first crystal lattice of said channel region, the lattice constant of said second crystalline lattice different from the lattice constant of said first crystalline lattice, and said first crystalline lattice comprised of Si x Ge 1−x and said second crystalline lattice comprised of Si y Ge 1−y , where 0<x<1, x≠y, and 0≦y<1.
2. The structure of claim 1 , wherein y=0.
3. A method of forming a semiconductor device comprising:
forming a substrate having a channel region comprising a first crystalline lattice; and
forming a pair of source and drain regions in said substrate and comprising a second crystalline lattice directly adjacent to said first crystal lattice of said channel region, the lattice constant of said second crystalline lattice different from the lattice constant of said first crystalline lattice, and said first crystalline lattice comprised of Si x Ge 1−x and said second crystalline lattice comprised of Si y Ge 1−y , where 0<x<1, x≠y, and 0≦y<1.
4. The method of claim 3 , wherein y=0.
5. A method of forming a semiconductor device comprising:
forming a substrate having a channel region comprising a first crystalline lattice;
forming a gate dielectric layer above said channel region;
forming a gate electrode above said gate dielectric layer;
removing a portion of said substrate from either side of said channel region to form a first etched-out region and a second etched-out region in said substrate; and
forming a source region in said first etched-out region and a drain region in said second etched-out region, wherein said source region and said drain region comprise a second crystalline lattice directly adjacent to said first crystalline lattice of said channel region, the lattice constant of said second crystalline lattice different from the lattice constant of said first crystalline lattice, and said first crystalline lattice comprised of Si x Ge 1−x and said second crystalline lattice comprised of Si y Ge 1−y , where 0<x<1, x≠y, and 0≦y<1.
6. The method of claim 5 , wherein y=0.
7. The semiconductor device of claim 1 , wherein said channel region is uniaxially strained, and wherein said pair of source and drain regions is uniaxially strained.
8. The method of claim 3 , wherein said pair of source and drain regions imparts a uniaxial strain to said channel region, and wherein said channel region imparts a uniaxial strain to said pair of source and drain regions.
9. The method of claim 5 , wherein said source region and said drain region impart a uniaxial strain to said channel region, and wherein said channel region imparts a uniaxial strain to said source region and to said drain region.