Magnetic writer including an electroplated high moment laminated pole
View Patent ↗A magnetic writing pole writes perpendicularly to a magnetic medium. The writing pole includes a multilayer structure with alternately electroplated magnetic layers and electroplated non-magnetic layers. The writing pole has a down-track thickness near the magnetic medium of less than about 500 nm.
1. A magnetic writing pole for perpendicular writing, the magnetic writing pole comprising:
a multilayer structure including alternately electroplated magnetic layers and electroplated non-magnetic layers, wherein a down-track thickness of the writing pole proximate the magnetic medium is less than about 500 nm, and wherein the electroplated magnetic and non-magnetic layers each comprise a random polycrystalline structure.
2. The magnetic writing pole of claim 1 , wherein the magnetic layers have a thickness in a range of about 10 nm to about 100 nm, and the non-magnetic layers have a thickness in a range of about 1 nm to about 25 nm.
3. The magnetic writing pole of claim 1 , wherein the non-magnetic layers have a thickness to effectively prevent exchange coupling between adjacent magnetic layers.
4. The magnetic writing pole of claim 1 , wherein the magnetic layers comprise a material selected from the group consisting of (1) CoFe including Fe of about 50 at % to about 70 at %, (2) CoFeRh including Fe of about 50 at % to about 70 at % and Rh of less than about 1 at %, (3) CoFeRu including Fe of about 50 at % to about 70 at % and Ru of less than about 2 at %, (4) CoFePd including Fe of about 50 at % to about 70 at % and Pd of less than about 2 at % (5) CoFeNi including Fe of about 50 at % to about 70 at % and Ni of less than about 8 at %, (6) CoFePt including Fe of about 50 at % to about 70 at % and Pt of less than about 2 at %, and (7) NiFe including Fe of at least about 65 at %.
5. The magnetic writing pole of claim 1 , wherein the magnetic layers have a magnetic moment of at least about 2.2 T.
6. The magnetic writing pole of claim 1 , wherein the first non-magnetic layer comprises a material selected from the group consisting of NiP including P of about 14 at % to about 26 at %, NiCu including Cu of greater than about 45 wt %, Cu, Ir, Pt, Rh, Ru, Pd, Au, Cr, NiCr, NiW, and NiPd.
7. The magnetic writing pole of claim 1 , wherein the magnetic writer comprises an even number of magnetic layers.
8. A magnetic writer comprising:
a writing pole including at least three multiple layer structures, each multiple layer structure including a separate electroplated magnetic layer and a separate electroplated non-magnetic layer adjoining the electroplated magnetic layer, wherein the at least three multiple layer structures are laminated to form a stack of alternating magnetic and nonmagnetic layers, wherein each electroplated magnetic and non-magnetic layer comprises a random polycrystalline structure.
9. The magnetic writer of claim 8 , and further comprising:
a magnetic layer electroplated on the non-magnetic layer at a top of the stack.
10. The magnetic writer of claim 8 , wherein the magnetic layer has a thickness in a range of about 10 nm to about 100 nm.
11. The magnetic writer of claim 8 , wherein the non-magnetic layer has a thickness in a range of about 1 nm to about 25 nm.
12. The magnetic writer of claim 8 , wherein the first magnetic layer comprises a material selected from the group consisting of CoFe, CoFeNi, CoFeRh, CoFeRu, CoFePt, CoFePd, and NiFe.
13. The writer pole of claim 8 , wherein the first non-magnetic layer comprises a material selected from the group consisting of NiP, NiCu, Cu, Rh, Ru, Ir, Pt, Pd, Au, Cr, NiCr, NiW, and NiPd.
14. The magnetic writing pole of claim 8 , wherein the magnetic writer comprises an even number of magnetic layers.
15. The magnetic writer of claim 8 , wherein the magnetic writer is configured to reduce a skew effect during writing to a magnetic medium.
16. The magnetic writer of claim 8 , and further comprising:
a return pole magnetically coupled to the writing pole distal from the magnetic medium.
17. A magnetic structure comprising:
a seed layer;
an electroplated first magnetic layer adjoining the seed layer;
an electroplated first non-magnetic layer directly adjoining the first magnetic layer in physical contact therewith;
an electroplated second magnetic layer directly adjoining the first non-magnetic layer in physical contact therewith;
an electroplated second non-magnetic layer directly adjoining the second magnetic layer in physical contact therewith;
an electroplated third magnetic layer directly adjoining the second non-magnetic layer in physical contact therewith;
an electroplated third non-magnetic layer directly adjoining the third magnetic layer in physical contact therewith; and
an electroplated fourth magnetic layer directly adjoining the third non-magnetic layer in physical contact therewith,
wherein each of the electroplated magnetic and non-magnetic layers comprises a random polycrystalline structure, and
wherein a thickness of the magnetic structure is less than about 500 nm.
18. The magnetic structure of claim 17 , wherein the magnetic structure comprises an even number of magnetic layers.
19. The magnetic structure of claim 17 , wherein the seed layer comprises a seed material selected from the group consisting of Hf and Ta.
20. The magnetic structure of claim 19 , wherein the seed layer further comprises a thin layer of NiZn on the seed material.