IP Library › Granted Patent US 7,387,966
Granted Patent B2
US 7,387,966 · App. 11/453,311 · Granted Jun 17, 2008

Manufacturing method for a semiconductor device

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Quick Facts
Patent No.
US 7,387,966
App. No.
11/453,311
Granted
Jun 17, 2008
Kind
B2
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2012
From: SEIKO EPSON CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028153/0654 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2006
From: FUKAZAWA, MOTOHIKO
To: SEIKO EPSON CORPORATION
Reel/Frame 017981/0206 →