High speed, high density, low power die interconnect system
View Patent ↗A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.
1. A system for the interconnection of a plurality of die, said system comprising:
a first die having a first die side edge and comprising a first die substrate upon which are disposed a plurality of first die conducting layers, said first die conducting layers in said plurality of first die conducting layers being separated from each other by first die dielectric layers, each first die conducting layer of said plurality of first die conducting layers being planar and extending to said first die side edge; each said first die conductive layer conductively abutting at least one first die contact being disposed on said first die side edge;
a second die having a second die side edge and comprising a second die substrate upon which are disposed plurality of second die conducting layers, said second die conducting layers in said plurality of second die conducting layers being separated from each other by second die dielectric layers, each said second die conducting layer of said plurality of second die conducting layers being planar and extending to said second die side edge; each said second die conductive layer conductively abutting at least one second die contact being disposed on said second die side edge, said second die being disposed horizontally relative to said first die such that said first die side edge opposes said second die side edge and each said first die conducting layer and an opposing second die conducting layer are substantially coplanar;
at least one interconnect structure disposed between opposing said first and second die side edges whereby said first die contact is coupled to a selected second die contact of said opposing second die and signals are allowed to pass between each said first die conducting layer and said opposing second die conducting layer.
2. The system of claim 1 , wherein said interconnect structure provides direct coupling and is selected from at least one of the group consisting of: rod, ball, dual balls, bar, cylinder, bump, slug, carbon nanotube, conductive contact pad, enlarged contact, and fiber optic cable.
3. The system of claim 1 , wherein said at least two die have multiple sides and at least one said interconnect structure is coupled to at least one of said sides.
4. The system of claim 1 , wherein at least one of said first die and said second die has features to facilitate mating of said interconnect structure, said features selected from the group consisting of dogleg cuts, grooves, notches, conductive contact pads, enlarged contacts, tapered side edges, terraces and stepped vias.
5. The system of claim 1 , further comprising at least one bus coupled to at least one of said first die conducting layers or said second die conducting layers, said bus coupled to said interconnect structure.
6. The system of claim 1 , wherein at least one of said first die and said second die further comprises at least one of active elements and passive elements.
7. The system of claim 1 , wherein said interconnect structure provides indirect coupling, said indirect coupling consisting of at least one of the group consisting of: inductive coupling, capacitive coupling, and wireless coupling.