IP Library Granted Patent US 7,278,865
Granted Patent B1
US 7,278,865 · App. 11/470,814 · Granted Oct 9, 2007

Electronic device with a grounding mechanism

Assignee: Universal Scientific Industrial Co., Ltd.
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Quick Facts
Patent No.
US 7,278,865
App. No.
11/470,814
Granted
Oct 9, 2007
Kind
B1
Abstract

An electronic device includes: a conductive housing having an upright end wall formed with an opening; a mother board mounted in the conductive housing and having an end that is disposed adjacent to the upright end wall of the conductive housing, and a grounding trace that has a first end portion disposed adjacent to the end of the mother board, and a second end portion distal from the end of the mother board; a connector mounted on the mother board adjacent to the end of the mother board, extending through the opening in the upright end wall of the conductive housing, and having a grounding pin in electrical contact with the first end portion of the grounding trace; and a ground-bridging mechanism disposed adjacent to the first end portion of the grounding trace and bridging electrically the conductive housing and the first end portion of the grounding trace.

Claims (13)

1. An electronic device comprising:

a conductive housing having an upright end wall formed with an opening;

a mother board mounted in said conductive housing and having an end that is disposed adjacent to said upright end wall of said conductive housing, and a grounding trace that has a first end portion disposed adjacent to said end of said mother board;

a connector mounted on said mother board adjacent to said end of said mother board, extending through said opening in said upright end wall of said conductive housing, and having a grounding pin in electrical contact with said first end portion of said grounding trace; and

aground-bridging mechanism disposed adjacent to said first end portion of said grounding trace and bridging electrically said conductive housing and said first end portion of said grounding trace.

2. The electronic device of claim 1 , wherein said ground-bridging mechanism has a first spring arm that abuts resiliently against said conductive housing.

3. The electronic device of claim 2 , wherein said upright end wall of said conductive housing has a lower end, said conductive housing further having a board-mounting wall transverse and connected to said lower end of said upright end wall, said mother board being mounted on said board-mounting wall, said first spring arm abutting resiliently against said board-mounting wall.

4. The electronic device of claim 2 , wherein said ground-bridging mechanism further has a trace-connecting plate that is bent from said first spring arm and that is soldered to said first end portion of said grounding trace.

5. The electronic device of claim 2 , further comprising a metal shield mounted on said upright end wall of said conductive housing and formed with a through-hole that is registered with said opening in said upright end wall for extension of said connector therethrough, said metal shield having a lower end, said first spring arm of said ground-bridging mechanism extending from said lower end of said metal shield to said conductive housing.

6. The electronic device of claim 5 , wherein said upright end wall of said conductive housing has a lower end, said conductive housing further having a board-mounting wall transverse and connected to said lower end of said upright end wall, said first spring arm of said ground-bridging mechanism extending from said lower end of said metal shield to said board-mounting wall of said conductive housing.

7. The electronic device of claim 5 , wherein said ground-bridging mechanism further has a second spring arm that abuts resiliently against said lower end of said metal shield, a fixed plate bent from said second spring arm, and at least one wing extending from said fixed plate through said mother board to contact electrically said first end portion of said grounding trace.

8. The electronic device of claim 5 , wherein said ground-bridging mechanism further has a second spring arm that is formed by cutting a portion of said metal shield and by bending said portion of said metal shield toward said end of said mother board, said second spring arm extending through said opening in said upright end wall of said conductive housing, and abutting resiliently against said first end portion of said conductive trace.

9. The electronic device of claim 8 , wherein said end of said mother board has an end face facing said upright end wall of said conductive housing, said first end portion of said conductive trace extending to and covering said end face of said end of said mother board.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2011
From: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
To: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
Reel/Frame 025658/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2006
From: SU, SHIAU-WEI; HU, CHIEN-MING; YU, HSIANG-LUNG; SHIH, CHUN-HSUAN
To: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD
Reel/Frame 018217/0441 →