Ball grid array package enhanced with a thermal and electrical connector
View Patent ↗Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the stiffener can be greater than, equal to, or less than an area of the surface of the substrate. A thermal connector is coupled to the surface of the stiffener through the opening. A surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. The thermal connector can have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. Alternatively, the stiffener and thermal connector may be combined into a single piece stiffener, wherein the stiffener has a protruding portion. The protruding portion extends through the opening when the stiffener is coupled to the substrate, and is capable of attachment to the PCB.
1. A ball grid array (BGA) package, comprising:
a substrate that has a surface, wherein said surface has an opening therein;
a stiffener that has a surface coupled to said surface of said substrate; and
a thermal connector coupled to said surface of said stiffener through said opening in the substrate, wherein said thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB
wherein said thermal connector has a height such that said thermal connector extends into an opening formed in a surface of the PCB when the BGA package is mounted to the PCB.
2. The package of claim 1 , further comprising:
an IC die mounted to a second surface of said stiffener.
3. The package of claim 2 , further comprising:
an encapsulate material that encapsulates said IC die on said second surface of said stiffener.
4. The package of claim 1 , wherein said stiffener has an edge, wherein at least a portion of said edge is patterned.
5. The package of claim 1 , further comprising:
a sealant material that substantially fills a gap around said thermal connector between said thermal connector and said substrate in said opening in said substrate.
6. The package of claim 1 , wherein said thermal connector is a heat sink.
7. The package of claim 1 , wherein said thermal connector is a heat spreader.
8. The package of claim 1 , wherein said thermal connector is a heat slug.
9. The package of claim 1 , further comprising an adhesive that attaches the thermal connector in the opening formed in the surface of the PCB.
10. The package of claim 1 , wherein the thermal connector extends through the opening in the first surface of the PCB and a surface of the thermal connector is exposed at a second surface of the PCB.
11. The package of claim 1 , wherein the opening in the PCB is a cavity.