Method of treating and removing a photoresist pattern and method of manufacturing a semiconductor device using the same
Example embodiments of the present invention relate to methods of treating and removing a photoresist pattern and a method of manufacturing a semiconductor device using the same. Other example embodiments of the present invention relate to a method of treating a photoresist pattern and a method of removing a photoresist pattern formed using a photoresist composition suitable for argon fluoride (ArF). In a method of removing a photoresist pattern, an ozone vapor including a water vapor and an ozone gas may be provided onto the photoresist pattern to remove a hydrophobic group from a photoresist resin included in the photoresist pattern. A cleaning solution may be provided to make the photoresist pattern water-soluble. A cleaning process may be performed on the photoresist pattern to remove the photoresist pattern. The photoresist pattern may be effectively removed without an increased processing time and/or damage to a substrate.
1. A method of treating a photoresist pattern comprising:
providing an ozone vapor including a water vapor and an ozone gas onto the photoresist pattern to remove a hydrophobic group from a photoresist resin included in the photoresist pattern; and
providing a cleaning solution including an acid or an alkali solution to make the photoresist pattern soluble in water.
2. The method of claim 1 , wherein the photoresist resin includes an acrylate polymer or a methacrylate polymer including a carbon-carbon single bond.
3. The method of claim 1 , wherein the ozone vapor includes a hydroxyl ion (OH − ).
4. The method of claim 1 , further comprising:
performing a cleaning process using water on the photoresist pattern to remove the photoresist pattern.
5. The method of claim 3 , wherein the hydrophobic group from the photoresist resin is removed by the hydroxyl ion generated from a reaction between the water vapor and the ozone gas.
6. The method of claim 1 , wherein the ozone vapor has an ozone density of about 150 g/m 3 to about 250 g/m 3 .
7. The method of claim 1 , wherein providing the ozone vapor and providing the cleaning solution including the acid solution or the alkali solution are performed at a temperature of about 90° C. to about 120° C.
8. The method of claim 1 , wherein providing the ozone vapor and providing the cleaning solution including the acid solution or the alkali solution are performed at a pressure of about 40 kPa to about 100 kPa.
9. The method of claim 3 , wherein the photoresist pattern is made to be soluble in water by binding the hydroxyl ion and one of a hydrogen ion (H + ) and an alkali ion instead of the hydrophobic group in the photoresist resin.
10. The method of claim 1 , further comprising:
forming the photoresist pattern, wherein forming the photoresist pattern includes:
forming a structure on a substrate;
adhering a photoresist composition for ArF on the structure to form a photoresist film;
performing a light-exposure process or a developing process on the photoresist film to form the photoresist pattern.
11. The method of claim 10 , wherein the structure may include a metal layer, a metal oxide layer, a metal nitride layer, an oxide layer, a polysilicon layer and a barrier layer.
12. The method of claim 10 , wherein an exposed portion of the structure is selectively etched using the photoresist pattern as an etching mask to form a structure pattern having an opening.
13. A method of treating a photoresist pattern comprising:
providing an ozone vapor including a water vapor and an ozone gas onto the photoresist pattern to remove a hydrophobic group from a photoresist resin included in the photoresist pattern;
providing an acid or an alkali solution to make the photoresist pattern soluble in water; and
performing a cleaning process using water on the photoresist pattern to remove the photoresist pattern.
14. A method of treating a photoresist pattern comprising:
removing a hydrophobic group from a photoresist resin included in the photoresist pattern by providing an ozone vapor including a water vapor and an ozone gas onto the photoresist pattern to form a positive ion-binding site in the photoresist resin included in the photoresist pattern; and
providing an acid or an alkali solution to make the photoresist pattern soluble in water,
wherein the acid solution or the alkali solution provide a positive ion including a hydrogen ion or an alkali ion binding the positive ion-binding site in the photoresist resin included in the photoresist pattern.
15. The method of claim 14 , wherein the positive ion-binding site in the photoresist resin includes a carboxyl ion (COO − ) having a negative charge.