Light emitting devices and method for fabricating the same
Light emitting devices and a method for fabricating the same have an advantage in that an etching film formed between a plurality of light emitting structures is removed to separate respective lateral surfaces of the light emitting structures from one another, and a substrate is removed to separate lower portions of the devices from each other, thereby further facilitating division of the devices. There are further advantages in that the devices are divided without carrying out a scribing process so that the occurrence of defects such as cracking or bending can be reduced, and spacing between the devices for the scribing process need not be maintained, thereby increasing the degree of integration of devices.
1. A method for fabricating light emitting devices, comprising:
forming a plurality of light emitting structures on a substrate such that the structures are spaced apart from one another;
forming an etching film made of a selectively etchable material between adjacent light emitting structures;
forming a metallic film covering the plurality of light emitting structures and the etching film;
separating the substrate from the plurality light emitting structures and the etching film covered by the metallic film;
removing the etching film; and
individually dividing the plurality of light emitting structures covered by the metallic film.
2. The method as claimed in claim 1 , wherein the metallic film is at most partially formed on a top of the etching film, thereby forming an empty space on the top of the etching film so that the metallic film is divided into pieces, each piece containing at least one light emitting structure.
3. A method for fabricating light emitting devices, comprising:
forming a plurality of light emitting structures on a substrate such that the structures are spaced apart from one another;
forming an etching film between adjacent light emitting structures, the etching film having a height larger than that of the plurality of light emitting structures and made of a selectively etchable material;
forming a metallic film covering the plurality of light emitting structures and lateral surfaces of the etching film while exposing a top of the etching film;
removing the etching film; and
separating the substrate from the plurality light emitting structures covered by the metallic film.
4. A method for fabricating light emitting devices, comprising:
forming a plurality of light emitting structures on a substrate such that the structures are spaced apart from one another;
forming an etching film between adjacent light emitting structures, the etching film having a height larger than that of the plurality of light emitting structures and made of a selectively etchable material;
forming a metallic film covering the etching film and the plurality of light emitting structures;
removing an upper portion of the metallic film to expose a top of the etching film;
removing the etching film; and
separating the substrate from the plurality light emitting structures covered by the metallic film.
5. The method as claimed in claim 1 , wherein each of the plurality of light emitting structures comprises an n-semiconductor layer, an active layer and a p-semiconductor layer, which are sequentially stacked, and an insulation film is formed on lateral surfaces of the n-semiconductor layer, the active layer and the p-semiconductor layer.
6. The method as claimed in claim 1 , wherein the substrate comprises a sapphire substrate.
7. The method as claimed in claim 1 , wherein the step of separating the substrate is performed using a laser lift off process.
8. The method as claimed in claim 1 , wherein the selectively etchable material comprises a photoresist or a polyimide.
9. The method as claimed in claim 1 , wherein the etching film has a width of about 5 to 50 □m and a height of about 5 to 100 □m.
10. The method as claimed in claim 1 , wherein the step of removing the etching film comprising removing the etching film by means of etching using an organic solvent.
11. A method for fabricating light emitting devices, comprising the steps of:
forming a plurality of GaN-based light emitting structures on a substrate such that the structures are spaced apart from one another;
forming an electrode on each of the plurality of GaN-based light emitting structures;
forming an insulation film covering lateral side surfaces of the plurality of GaN-based light emitting structures and lateral surfaces of the electrodes while isolating the plurality of GaN-based light emitting structures from one another;
forming a seed layer covering a top of the electrode and a surface of the insulation film;
forming an etching film made of a selectively etchable material on the seed layer between the spaced-apart GaN-based light emitting structures;
forming a metallic film covering a top of the seed layer and the etching film;
separating the substrate from the plurality of GaN-based light emitting structures;
removing the etching film; and
individually dividing the plurality of GaN-based light emitting structures covered by the metallic film.
12. The method as claimed in claim 11 , wherein each of the plurality of GaN-based light emitting structures comprises a first semiconductor layer with a first polarity, an active layer, and a second semiconductor layer with a second polarity opposite to the first polarity.
13. The method as claimed in claim 11 , wherein the insulation film comprises a highly reflective film with an insulating property.
14. The method as claimed in claim 11 , wherein the seed layer comprises an under bump metallization (UBM) layer.
15. The method as claimed in claim 11 , wherein the metallic film is formed through a plating process.
16. The method as claimed in claim 15 , wherein an unbonded interface area is formed from a top of the etching film to a surface of the metallic film by means of the plating process.
17. The method as claimed in claim 11 , wherein the selectively etchable material comprises photoresist or polyimide.
18. The method as claimed in claim 17 , wherein the step of removing the etching film comprises removing the etching film by means of etching using an organic solvent.