Patent Assignment
Reel/Frame 072529/0173
Assignment of Assignor's Interest
Recorded: 2025-08-25
Pages: 9
Assignor
LG ELECTRONICS INC.
Executed: 2025-08-11
Assignee
SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
168 CHANGSHENG NORTH ROAD, TAICANG CITY, CHINA
Covered Properties
(68)
Light Emitting Device Package and Lighting Apparatus Using the Same
Light Emitting Device Having Light Extraction Structure
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure
Light Emitting Diode Having Vertical Topology and Method of Making the Same
Light Emitting Diode Having Vertical Topology and Method of Making the Same
Light Emitting Diode Having Vertical Topology and Method of Making the Same
Light Emitting Diode Having Vertical Topology and Method of Making the Same
Light Emitting Diode Having Vertical Topology and Method of Making the Same
Light Emitting Device Having Vertical Structure and Method for Manufacturing the Same
Light Emitting Device Having Vertical Structrue and Method for Manufacturing the Same
Light Emitting Device Package and Method for Manufacturing the Same
Light Emitting Device Package and Method for Manufacturing the Same
Lens, Manufacturing Method Thereof and Light Emitting Device Package Using the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device Package And Method For Manufacturing The Same
Nitride-Based Light Emitting Device
Nitride-Based Light Emitting Device
Nitride-Based Light Emitting Device
Nitride Based Light Emitting Device
Nitride Based Light Emitting Device
Vertical Light Emitting Device Having a Photonic Crystal Structure
Light Emitting Device Having Vertical Structure and Method for Manufacturing the Same
Light Emitting Unit, Apparatus and Method for Manufacturing the Same, Apparatus for Molding Lens Thereof, and Light Emitting Device Package Thereof
Sub-Mount for Mounting Light Emitting Device and Light Emitting Device Package
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Light Emitting Device Having Light Extraction Structure and Method for Manufacturing the Same
Post Structure, Semiconductor Device and Light Emitting Device Using the Structure, and Method for Forming the Same
Light Emitting Device Package and Method of Manufacturing the Same
Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device Having Vertical Structure and Package Thereof
Light Emitting Device Having Vertical Structure, Package Thereof and Method for Manufacturing the Same
Light Emitting Device Having Vertical Structure and Package Thereof
Light Emitting Device Having Vertical Structure, Package Thereof and Method for Manufacturing the Same
Light Emitting Device Having Vertical Structure and Package Thereof
Light Emitting Device Having Vertical Structure and Package Thereof
Light Emitting Device Having Vertical Structure and Method for Manufacturing the Same
Lead Frame and Light Emitting Device Package Using the Same
Method for Fabricating Substrate with Nano Structures, Light Emitting Device and Manufacturing Method Thereof
Led Having Vertical Structure and Method for Fabricating the Same
Led Having Vertical Structure and Method for Fabricating the Same
Light Emitting Device and Method for Fabricating the Same
Light Emitting Device Package and Backlight Unit Using the Same
Light Emitting Device Package and Backlight Unit Using the Same
Light Emitting Device Package and Backlight Unit Using the Same
Light Emitting Device Package and Backlight Unit Using the Same
Light Emitting Devices and Method for Fabricating the Same
Light Emitting Diode
Method for Manufacturing Light Emitting Diodes
Vertical Structure Led and Fabricating Method Thereof
Method of Manufacturing Light Emitting Diodes
Light Emitting Device Having Nano Structures for Light Extraction
Rod Type Light Emitting Device
Rod Type Light Emitting Device and Method for Fabricating the Same
Light Emitting Device Package and Method for Manufacturing the Same
Optical Lens, Light Emitting Device Package Using the Optical Lens, and Backlight Unit
Backlight Unit Having Light Emitting Diodes and Method for Manufacturing the Same
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 24, 2007
From: KIM, GEUN HO; LEE, SEUNG YEOB; WON, YU HO
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD
Reel/Frame 019338/0357 →
Assignment of Assignor's Interest
Jun 14, 2007
From: JANG, JUN HO; CHOI, JAE WAN; BAE, DUK KYE; CHO, HYUN KYONG
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD
Reel/Frame 019459/0490 →
Assignment of Assignor's Interest
Sep 11, 2007
From: JANG, JUN HO; CHOI, JAE WAN; BAE, DUK KYE; CHO, HYUN KYONG
To: LG ELECTRONICS INC. AND LG INNOTEK CO., LTD
Reel/Frame 019859/0073 →
Assignment of Assignor's Interest
Dec 4, 2007
From: KIM, YONG SUK; HURH, HOON; KIM, GEUN HO; WON, YU HO
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD.
Reel/Frame 020240/0447 →
Assignment of Assignor's Interest
Aug 7, 2008
From: KIM, SUN KYUNG
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD
Reel/Frame 021352/0319 →
Assignment of Assignor's Interest
Apr 28, 2009
From: JANG, JUN HO; LEE, HYUN JAE
To: LG ELECTRONICS INC. AND LG INNOTEK CO., LTD.
Reel/Frame 022622/0295 →
Assignment of Assignor's Interest
Feb 4, 2010
From: JANG, JUN HO; LEE, HYUN JAE
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD
Reel/Frame 023967/0984 →
Assignment of Assignor's Interest
Jul 12, 2010
From: SEO, BU WAN; KIM, SUNG WOO; HUR, HOON; KIM, YONG SUK
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD.
Reel/Frame 024665/0894 →
Assignment of Assignor's Interest
Sep 13, 2010
From: JANG, JUN HO; CHOI, JAE WAN; BAE, DUK KYE; CHO, HYUN KYONG
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD.
Reel/Frame 024977/0976 →
Assignment of Assignor's Interest
Aug 26, 2011
From: JANG, JUN HO; CHOI, JAE WAN; BAE, DUK KYE; PARK, JONG KOOK
To: LG ELECTRONICS INC.
Reel/Frame 026816/0884 →
Assignment of Assignor's Interest
Dec 4, 2013
From: JANG, JUN HO; CHOI, JAE WAN; BAE, DUK KYE; CHO, HYUN KYONG
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD.
Reel/Frame 031717/0546 →
Corrective Assignment to Correct the Assignors and Assignee Previously Recorded at Reel 026816 Frame 0884 the Assignors' Hereby Confirm the Assignment of the Entire Interest.
Dec 4, 2013
From: JANG, JUN HO; CHOI, JAE WAN; BAE,DUK KYU; CHO, HYUN KYONG
To: LG ELECTRONICS, INC.; LG INNOTEK CO., LTD.
Reel/Frame 031868/0964 →
Assignment of Assignor's Interest
May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →