IP Library Granted Patent US 7,869,674
Granted Patent B2
US 7,869,674 · App. 12/359,842 · Granted Jan 11, 2011

Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof

Assignees: LG Electronics Inc.; LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 7,869,674
App. No.
12/359,842
Granted
Jan 11, 2011
Kind
B2
Abstract

A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

Claims (10)

1. A light emitting device package module, comprising:

a printed circuit board;

at least one package body located on the printed circuit board;

at least one lens directly molded on the package body; and

at least one board protector on the printed circuit board, the board protector being formed as a strip extending along the periphery of the lens, the strip being a circular protrusion and being coupled to the printed circuit board.

2. The light emitting device package module according to claim 1 , wherein the board protector is to protect the printed circuit board during the direct lens molding process.

3. The light emitting device package module according to claim 1 , wherein the board protector is in contact with the edge of the lens.

4. The light emitting device package module according to claim 1 , wherein the package body includes a lead printed on the printed circuit board to configure a desired circuit, and

wherein the board protector has a height larger than that of the lead.

5. The light emitting device package module according to claim 1 , wherein the board protector is made of an elastic material.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2025
From: LG ELECTRONICS INC.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 072529/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2006-0052037 · Jun 9, 2006 · national
Continuity (2)
Continuation 1170711200 · Feb 16, 2007
Related Publication 20090136179A1 · May 28, 2009