IP Library Granted Patent US 7,733,573
Granted Patent B2
US 7,733,573 · App. 11/902,779 · Granted Jun 8, 2010

Lens, manufacturing method thereof and light emitting device package using the same

Assignee: LG Electronics Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,733,573
App. No.
11/902,779
Granted
Jun 8, 2010
Kind
B2
Abstract

A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.

Claims (9)

1. A method of manufacturing a lens comprising:

preparing at least one surface mount portion having a first part and a second part to be fixed on the lens,

fixing a first part of the surface mount portion on a first mold, wherein the first mold is divided into at least two portions, by coupling the at least two portions while the surface mount portion is disposed at an inside of the first mold,

fixing a second mold on the first mold and injecting a lens material into the second mold; and

processing the lens material to form the lens and removing the first mold and the second mold.

2. The method according to claim 1 , wherein the lens material is formed of thermosetting resin such as silicone, epoxy, PC, and PMMA or thermoplastic resin, and

the lens material is processed by cooling the lens material.

3. The method according to claim 1 , wherein the first mold is formed of metal which is not mixed with Au, Ag, Cu, and Al.

4. The method according to claim 1 , wherein the second mold is formed of metal which is not mixed with thermosetting resin such as silicone, epoxy, PC, and PMMA or thermoplastic resin.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2025
From: LG ELECTRONICS INC.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 072529/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2007
From: KIM, YONG SUK; HURH, HOON; KIM, GEUN HO; WON, YU HO
To: LG ELECTRONICS INC.; LG INNOTEK CO., LTD.
Reel/Frame 020240/0447 →
Priority Claims (1)
KR 10-2006-0094629 · Sep 28, 2006 · national
Continuity (1)
Related Publication 20080088953A1 · Apr 17, 2008