IP Library Granted Patent US 8,003,993
Granted Patent B2
US 8,003,993 · App. 12/637,637 · Granted Aug 23, 2011

Light emitting device having light extraction structure

Assignees: LG Innotek Co., Ltd.; LG Electronics Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,003,993
App. No.
12/637,637
Granted
Aug 23, 2011
Kind
B2
Abstract

A nitride-based light emitting device capable of achieving an enhancement in emission efficiency and an enhancement in reliability is disclosed. The light emitting device includes a semiconductor layer, and a light extracting layer arranged on the semiconductor layer and made of a material having a refractive index equal to or higher than a reflective index of the semiconductor layer.

Claims (42)

1. A light emitting device comprising:

a conductive support structure;

a first electrode over the conductive support structure;

a semiconductor layer over the first electrode;

a light extracting structure arranged over the semiconductor layer; and

a second electrode over the semiconductor layer,

wherein the light extracting structure has a plurality of holes or grooves,

wherein a transparent material that is different from a material of the light extracting structure is located in the holes or grooves,

and wherein the refractive index of the light extracting structure is greater or less than the refractive index of the transparent material.

2. The light emitting device according to claim 1 , wherein the plurality of holes or grooves are regularly distributed.

3. The light emitting device according to claim 1 , further comprising:

a transparent conducting layer between the light extracting structure and the semiconductor layer.

4. The light emitting device according to claim 3 , wherein the transparent conducting layer has a thickness of λ/16n to λ/2n (where “λ” represents a wavelength of emitted light and “n” represents a refractive index of the transparent conducting layer).

5. The light emitting device according to claim 1 , further comprising:

a transparent metal layer between the light extracting structure and the semiconductor layer.

6. The light emitting device according to claim 5 , wherein the transparent metal layer comprises Ni and/or Au, or an alloy containing Ni and Au.

7. The light emitting device according to claim 1 , wherein the light extracting structure comprises an oxide or a nitride.

8. The light emitting device according to claim 1 , wherein the refractive index of the light extracting structure is 2.4 or more.

9. The light emitting device according to claim 1 , wherein the light extracting structure comprises SiN or TiO 2 .

10. The light emitting device according to claim 1 , wherein the semiconductor layer comprises:

an n-type semiconductor layer;

an active layer arranged on the n-type semiconductor layer; and

a p-type semiconductor layer arranged on the active layer.

11. The light emitting device according to claim 10 , wherein the p-type semiconductor layer has a thickness of 30 to 500 nm.

12. The light emitting device according to claim 1 , wherein the light extracting structure comprises a dielectric layer.

13. The light emitting device according to claim 1 , wherein the light extracting structure has a thickness of 150 nm or more.

14. The light emitting device according to claim 1 , wherein the semiconductor layer comprises:

a p-type semiconductor layer;

an active layer arranged on the p-type semiconductor layer; and

an n-type semiconductor layer arranged on the active layer.

15. The light emitting device according to claim 1 , wherein the first electrode comprises:

a reflective electrode; and

an ohmic electrode arranged on the reflective electrode.

16. The light emitting device according to claim 1 , wherein the conductive support structure comprises a metal or a semiconductor.

17. The light emitting device according to claim 1 , wherein the transparent material comprises an oxide.

18. The light emitting device according to claim 17 , wherein the transparent material comprises a transparent conducting oxide.

19. The light emitting device according to claim 1 , wherein the light extracting structure is formed on the semiconductor layer.

20. The light emitting device according to claim 1 , wherein the light extracting structure is formed by etching the semiconductor layer.

21. The light emitting device according to claim 1 , wherein the radius of hole or the groove is in the range of 0.1a to 0.45a, where “a” is an average distance between adjacent holes or grooves.

22. The light emitting device according to claim 1 , wherein the average distance between adjacent holes or grooves is in the range of 200nm to 5,000 nm.

23. The light emitting device according to claim 22 , wherein the depth of the hole or the groove is in the range of 0.25λ/n to 10λ/n, where “λ” represents the wavelength of emitted light and “n” represents the refractive index of the light extracting structure.

24. The light emitting device according to claim 22 , wherein the holes or grooves have a depth configured to saturate the extraction efficiency of the light extracting structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2025
From: LG ELECTRONICS INC.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 072529/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (4)
KR 10-2006-0041006 · May 8, 2006 · national
KR 10-2007-0037414 · Apr 17, 2007 · national
KR 10-2007-0037415 · Apr 17, 2007 · national
KR 10-2007-0037416 · Apr 17, 2007 · national
Continuity (2)
Division 11797727 · May 7, 2007
Related Publication 20100090242A1 · Apr 15, 2010