Sub-mount for mounting light emitting device and light emitting device package

1. A light emitting device package comprising:

a package body having a mount for mounting a light emitting device, and through holes;

a seed metal layer formed on the package body;

electrodes formed on the seed metal layer, the electrodes connected with the light emitting device electrically, wherein the electrodes comprise an adhesion layer, an electrode metal, and a diffusion barrier layer that is between the adhesion layer and the electrode metal; and

a reflective layer arranged on the electrodes, the reflective layer having at least one opening.

2. The light emitting device package according to claim 1 , wherein the reflective layer comprises Al or Ag.

3. The light emitting device package according to claim 1 , further comprising:

a zener diode formed on the package body and electrically connected to the mount.

4. The light emitting device package according to claim 3 , wherein the zener diode comprises a diffusion layer formed on the package body such that the diffusion layer is in contact with one of the electrodes, the diffusion layer having a polarity different from the polarity of the package body.

5. The light emitting device package according to claim 1 , wherein the light emitting device comprises a plurality of light emitting devices mounted on the mount.

6. The light emitting device package according to claim 5 , wherein three or four light emitting devices are mounted on the mount.

7. The light emitting device package according to claim 5 , wherein each of the light emitting devices emits red, green, or blue light.

8. The light emitting device package according to claim 1 , wherein the seed metal is deposited on the surfaces of the through holes.

9. The light emitting device package according to claim 1 , wherein the seed metal is to assist formation of electrodes on the package body.

10. The light emitting device package according to claim 1 , wherein the seed metal is deposited on front and rear surfaces of the package body.

11. The light emitting device package according to claim 1 , wherein the diffusion barrier layer comprises at least one of Pt and Ni.

12. A light emitting device package comprising:

a package body comprising at least one of semiconductor substrate, substrate comprising at least one of aluminum nitride, aluminum oxide, photo sensitive glass, Al 2 O 3 , BeO, and PCB substrate;

an insulating layer coated over the sides of the package body;

a mount for mounting a light emitting device, the mount formed on the package body;

electrodes formed on the insulating layer connected to the bottom of the package body via the sides of the package body, the electrodes connected with the light emitting device electrically, wherein the electrodes comprise an adhesion layer on the insulating layer, an electrode metal, and a diffusion barrier layer that is between the adhesion layer and the electrode metal.

13. The light emitting device package according to claim 12 , further comprising:

a zener diode electrically connected to the mount.

14. The light emitting device package according to claim 12 , wherein the mount is formed on the upper surface of the package body.

15. The light emitting device package according to claim 12 , further comprising

a reflective layer arranged on the electrodes.

16. The light emitting device package according to claim 12 , wherein the light emitting device comprises a plurality of light emitting devices mounted on the mount.

17. The light emitting device package according to claim 16 , wherein three or four light emitting devices are mounted on the mount.

18. The light emitting device package according to claim 17 , wherein each of the light emitting devices emits red, green, or blue light.