Method of making circuitized substrate with filled isolation border
View Patent ↗A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.
1. A method of making a circuitized substrate, said method comprising:
providing a single electrically conductive sheet of substantially planar configuration having first and second opposing surfaces, said single electrically conductive sheet including at least one side edge portion comprising a first plurality of openings;
positioning a first dielectric layer on said first opposing surface of said single electrically conductive sheet;
substantially filling selected ones of said first plurality of openings of said one side edge portion with a portion of said first dielectric layer;
forming a second plurality of openings in said first dielectric layer;
positioning a second dielectric layer on said second opposing surface of said single electrically conductive sheet; and
substantially filling the remaining ones of said second plurality of openings of said one side edge portion with a portion of said second dielectric layer, said portions of said first and second dielectric layers providing a substantially solid dielectric covering over a plurality of the contiguous formed open segments of said at least one side edge portion.
2. The method of claim 1 wherein said plurality of contiguous formed open segments are provided using a drilling operation.
3. The method of claim 2 wherein said drilling operation is accomplished using mechanical drills.
4. The method of claim 2 wherein said drilling operation is accomplished using a laser.
5. The method of claim 1 wherein said positioning said first dielectric layer on said first opposing surface of said single electrically conductive sheet and said substantially filling said selected ones of said first plurality of openings of said one side edge portion with a portion of said first dielectric layer are accomplished utilizing a lamination process.
6. The method of claim 1 wherein said positioning said second dielectric layer on said second opposing surface of said single electrically conductive sheet and said substantially filling said remaining ones of said second plurality of openings of said one side edge portion with a portion of said second dielectric layer are accomplished utilizing a lamination process.