Lead pin, circuit, semiconductor device, and method of forming lead pin
A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity.
1. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
wherein said gap is placed between said insulator and said conductor, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
2. The lead pin according to claim 1 , wherein a thickness of said insulator is non-uniform.
3. The lead pin according to claim 1 , wherein an end of said conductor is connectable to a ground potential.
4. The lead pin according to claim 1 , wherein said lead pin is adjustable to substantially match impedances of a signal line of a circuit connectable to said lead pin and a signal line of a printed-circuit board, said circuit being mountable on said printed-circuit board.
5. A circuit, comprising:
said lead pin according to claim 1 .
6. A semiconductor device, comprising:
said circuit according to claim 5 ; and
a printed-circuit board, said circuit being connectable to said printed-circuit board through said lead pin.
7. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
wherein said gap is placed in an arc of said conductor along a longitudinal direction of said conductor, being extended at a same location of said arc, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
8. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
said conductor comprising a plurality of gaps that are placed along a longitudinal direction of said conductor at different locations of arcs, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
9. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
wherein said conductor includes said gap in a mesh state, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
10. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
wherein said gap is placed in an arc of said conductor along a longitudinal direction of said conductor, being extended as a wavy line, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
11. A lead pin of a circuit, comprising:
a pin;
an insulator that surrounds said pin; and
a conductor that surrounds said insulator,
said conductor including non-uniformity and said conductor comprising a gap,
wherein a plurality of said gaps are extended in a direction perpendicular to a longitudinal direction of said pin, and
wherein said conductor comprises a thinner portion at a location where said gap is placed than another portion of said conductor.
12. A method of forming a lead pin, comprising:
surrounding a pin with an insulator;
surrounding said insulator with a conductor that includes non-uniformity;
providing a gap in said conductor;
placing said gap between said insulator and said conductor; and making said conductor thinner at a location of said gap than another portion of said conductor.
13. The method according to claim 12 , further comprising:
placing said gap in an arc of said conductor, said gap being extended in a direction perpendicular to a longitudinal direction of said pin.
14. The method according to claim 12 , further comprising:
adjusting a thickness of said insulator.
15. The method according to claim 12 , further comprising: connecting an end of said conductor to a ground potential.
16. The method according to claim 12 , further comprising: adjusting said lead pin for matching of impedances of a signal line of a circuit connectable to said lead pin and a signal line of a printed-circuit board, said circuit being mountable on said printed-circuit board.
17. A method of forming a lead pin, comprising:
surrounding a pin with an insulator;
surrounding said insulator with a conductor that includes non-uniformity;
providing a gap in said conductor;
placing said gap in an arc of said conductor along a longitudinal direction of said conductor, said gap being extended at a same location of said arc; and
making said conductor thinner at a location of said gap than another portion of said conductor.
18. A method of forming a lead pin, comprising:
surrounding a pin with an insulator;
surrounding said insulator with a conductor that includes non-uniformity;
providing a gap in said conductor;
placing a plurality of gaps along a longitudinal direction of said conductor at different locations of arcs; and
making said conductor thinner at a location of said gap than another portion of said conductor.
19. A method of forming a lead pin, comprising:
surrounding a pin with an insulator; and
surrounding said insulator with a conductor that includes non-uniformity;
providing a gap in said conductor;
providing said gap in a mesh state; and
making said conductor thinner at a location of said gap than another portion of said conductor.
20. A method of forming a lead pin, comprising:
surrounding a pin with an insulator; and
surrounding said insulator with a conductor that includes non-uniformity;
providing a gap in said conductor;
placing said gap in an arc of said conductor along a longitudinal direction of said conductor, being extended as a wavy line; and
making said conductor thinner at a location of said gap than another portion of said conductor.