IP Library › Assignment 034480/0328
Patent Assignment
Reel/Frame 034480/0328

Assignment of Assignor's Interest

Recorded: 2014-12-11 Pages: 3
Assignor
NEC SOLUTION INNOVATORS, LTD.
Executed: 2014-12-09
Assignee
NEC PLATFORMS, LTD.
2-6-1, KITAMIKATA, TAKATSU-KU, KAWASAKI-SHI, KANAGAWA, 213-8511, JAPAN
Covered Properties (3)
Connecting Structure, Printed Substrate, Circuit, Circuit Package and Method of Forming Connecting Structure
Patent: 7,554,187 →
Application: 11/444,447 →
Publication: US 2007/0080468
Lead Pin, Circuit, Semiconductor Device, and Method of Forming Lead Pin
Patent: 7,602,059 →
Application: 11/485,393 →
Publication: US 2007/0085191
Semiconductor Device
Patent: 7,514,956 →
Application: 11/699,358 →
Publication: US 2007/0198821
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2006
From: KAMIYA, HIROSHI
To: NEC SYSTEM TECHNOLOGY, LTD.
Reel/Frame 017948/0934 →
Assignment of Assignor's Interest Jul 13, 2006
From: NOBUTAKA, YASUSHI; KAMIYA, HIROSHI
To: NEC SYSTEM TECHNOLOGIES, LTD.
Reel/Frame 018058/0656 →
Assignment of Assignor's Interest Apr 23, 2007
From: NOBUTAKA, YASUSHI; KAMIYA, HIROSHI; OHNO, KUNIO
To: NEC SYSTEMS TECHNOLOGIES, LTD.
Reel/Frame 019198/0781 →
Merger and Change of Name Jul 10, 2014
From: NEC SYSTEM TECHNOLOGIES, LTD.; NEC SOFT, LTD.
To: NEC SOLUTION INNOVATORS, LTD.
Reel/Frame 033285/0512 →