IP Library Assignment 017948/0934
Patent Assignment
Reel/Frame 017948/0934

Assignment of Assignor's Interest

Recorded: 2006-06-01 Pages: 3
Assignor
KAMIYA, HIROSHI
Executed: 2006-05-19
Assignee
NEC SYSTEM TECHNOLOGY, LTD.
4-24, SHIROMI 1-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, JAPAN
Covered Property (1)
Connecting Structure, Printed Substrate, Circuit, Circuit Package and Method of Forming Connecting Structure
Patent: 7,554,187 →
Application: 11/444,447 →
Publication: US 2007/0080468
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Jul 10, 2014
From: NEC SYSTEM TECHNOLOGIES, LTD.; NEC SOFT, LTD.
To: NEC SOLUTION INNOVATORS, LTD.
Reel/Frame 033285/0512 →
Assignment of Assignor's Interest Dec 11, 2014
From: NEC SOLUTION INNOVATORS, LTD.
To: NEC PLATFORMS, LTD.
Reel/Frame 034480/0328 →