IP Library Granted Patent US 7,259,399
Granted Patent B2
US 7,259,399 · App. 11/490,231 · Granted Aug 21, 2007

Vertical GaN-based LED and method of manufacturing the same

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Quick Facts
Patent No.
US 7,259,399
App. No.
11/490,231
Granted
Aug 21, 2007
Kind
B2
Abstract

Provided are a vertical GaN-based LED and a method of manufacturing the same. The vertical GaN-based LED includes an n-electrode. An AlGaN layer is formed under the n-electrode. An undoped GaN layer is formed under the AlGaN layer to provide a two-dimensional electron gas layer to a junction interface of the AlGaN layer. A GaN-based LED structure includes an n-type GaN layer, an active layer, and a p-type GaN layer that are sequentially formed under the undoped GaN layer. A p-electrode is formed under the GaN-based LED structure. A conductive substrate is formed under the p-electrode.

Claims (25)

1. A vertical GaN-based light emitting diode (LED) comprising:

an n-electrode;

an AlGaN layer formed under the n-electrode;

an undoped GaN layer formed under the AlGaN layer to provide a two-dimensional electron gas (2DEG) layer to a junction interface of the AlGaN layer;

a GaN-based LED structure including an n-type GaN layer, an active layer, and a p-type GaN layer that are sequentially formed under the undoped GaN layer;

a p-electrode formed under the GaN-based LED structure; and

a conductive substrate formed under the p-electrode.

2. The vertical GaN-based LED according to claim 1 ,

wherein the surface of the AlGaN layer contacting the n-electrode has a Ga-face structure in which nitrogen (N) elements are disposed on a vertical uppermost layer of gallium elements.

3. The vertical GaN-based LED according to claim 1 ,

further comprising a conductive junction layer formed on the p-electrode or at an interface between the p-electrode and the conductive substrate.

4. The vertical GaN-based LED according to claim 1 ,

further comprising a reflective layer formed under the p-electrode.

5. The vertical GaN-based LED according to claim 1 ,

wherein the undoped GaN layer has a thickness of 50-500 Å.

6. The vertical GaN-based LED according to claim 1 ,

wherein the AlGaN layer has an Al content of 10-50%.

7. The vertical GaN-based LED according to claim 1 ,

wherein the AlGaN layer has a thickness of 50-500 Å.

8. The vertical GaN-based LED according to claim 1 ,

wherein the AlGaN layer is an undoped AlGaN layer.

9. The vertical GaN-based LED according to claim 1 ,

wherein the AlGaN layer is a doped AlGaN layer doped with n-type impurities.

10. The vertical GaN-based LED according to claim 1 ,

wherein the AlGaN layer is doped with silicon impurities or oxygen impurities.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →