Light emitting diode package with diffuser and method of manufacturing the same
View Patent ↗The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
1. A light emitting diode package comprising:
a substrate with an electrode formed thereon;
a light emitting diode chip mounted on the substrate;
an encapsulant applied around the light emitting diode chip, the encapsulant containing a diffuser; and
a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle,
whereby light from the light emitting diode chip is emitted out of the package without distortion.
2. The light emitting diode package according to claim 1 , wherein the substrate has a step formed on an upper surface thereof, the step surrounding a portion of the substrate where the light emitting diode chip is mounted.
3. The light emitting diode package according to claim 1 , wherein the substrate has a reflective layer formed on a side surface of a recessed portion formed on an upper surface thereof, the reflective layer surrounding the light emitting diode chip mounted on the substrate.
4. The light emitting diode package according to claim 1 , wherein the lens part is made of a material mixed with a phosphor.
5. The light emitting diode package according to claim 1 , wherein the lens part is made of a material mixed with a diffuser.
6. The light emitting diode package according to claim 1 , wherein the lens part is made of a material mixed with a phosphor and a diffuser.