IP Library Granted Patent US 7,511,536
Granted Patent B2
US 7,511,536 · App. 11/499,899 · Granted Mar 31, 2009

Cells of a customizable logic array device having independently accessible circuit elements

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Quick Facts
Patent No.
US 7,511,536
App. No.
11/499,899
Granted
Mar 31, 2009
Kind
B2
Abstract

Various embodiments of the invention provide for cell structures having independently accessible circuit elements as a part of a customizable logic array device. In one embodiment, a cell forming a portion of a customizable logic array device includes a base layer, which, in turn, including circuit elements each having one or more inputs and one or more outputs. The cell also includes a configuration layer configured to form a logic device from one or more of the circuit elements. Further, the cell includes an interlayer connection layer configured to connect each of the inputs and the outputs to the configuration layer so as to enable each of the circuit elements to be independently accessible. Advantageously, the interlayer connection layer facilitates usage of each of the circuit elements to reduce the number of unused circuit elements in the cell.

Claims (51)

1. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer including circuit elements each having one or more inputs and one or more outputs;

a configuration layer configured to form a logic device from one or more of said circuit elements; and

an interlayer connection layer configured to connect each of said inputs and said outputs to said configuration layer so as to enable each of said circuit elements to be independently accessible,

wherein a first subset of said inputs and said outputs is used to form said logic device and a second subset of said inputs and said outputs is available to form other logic devices, and wherein said interlayer connection layer comprises a connection, wherein at least one dimension of said connection violates at least one design rule defining a minimum value of said at least one dimension.

2. The cell of claim 1 wherein said interlayer connection layer facilitates usage of each of said circuit elements to reduce the number of unused circuit elements in said cell.

3. The cell of claim 1 wherein said at least one design rule is associated with defining a minimum area of overlap for said connection.

4. The cell of claim 1 wherein said configuration layer is further configured to remedy said violation.

5. The cell of claim 1 wherein said configuration layer is further configured to form said other logic devices using multiple cells.

6. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer including circuit elements each having one or more inputs and one or more outputs;

a configuration layer configured to form a logic device from one or more of said circuit elements; and

an interlayer connection layer configured to connect each of said inputs and said outputs to said configuration layer so as to enable each of said circuit elements to be independently accessible, wherein

a first subset of said inputs and said outputs is used to form said logic device and a second subset of said inputs and said outputs is available to form other logic devices, and wherein

said cell is a double-height cell including two pairs of p-well regions and n-well regions.

7. The cell of claim 1 wherein said customizable logic array device further comprises other cells forming a fabric with said cell, whereby cells in said fabric include any number of substantially contiguous cells.

8. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer including circuit elements each having one or more inputs and one or more outputs;

a configuration layer configured to form a logic device from one or more of said circuit elements; and

an interlayer connection layer configured to connect each of said inputs and said outputs to said configuration layer so as to enable each of said circuit elements to be independently accessible, wherein

a first subset of said inputs and said outputs is used to form said logic device and a second subset of said inputs and said outputs is available to form other logic devices, wherein

said customizable logic array device further comprises other cells forming a fabric with said cell, whereby cells in said fabric include any number of substantially contiguous cell, and wherein

said substantially contiguous cells exclude separations to accommodate power buses.

9. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer including circuit elements each having one or more inputs and one or more outputs;

a configuration layer configured to form a logic device from one or more of said circuit elements; and

an interlayer connection layer configured to connect each of said inputs and said outputs to said configuration layer so as to enable each of said circuit elements to be independently accessible, wherein

a first subset of said inputs and said outputs is used to form said logic device and a second subset of said inputs and said outputs is available to form other logic devices, and wherein

said cell is includes two pairs of a p-well region and a n-well region.

10. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer of circuit elements including one or more input terminals and one or more output terminals, said circuit elements including:

at least one multiplexer having a select input terminal, at least two input terminals and an output terminal;

at least one inverter having an input terminal and an output terminal, and

at least one NAND gate having two input terminals and an output terminal,

a configuration layer configured to establish a minimum area of via overlap for each of said input terminals and said output terminals; and

a via layer formed with locations via determined in accordance with a non-compliant connectivity grid in which at least one distance measurement violates a minimum distance, said via layer is further configured to connect each of said input terminals and said output terminals to said configuration layer so as to be independently accessible,

wherein said minimum area of via overlap is formed to avoid a violation of said minimum distance.

11. The cell of claim 10 wherein said minimum area of via overlap is formed as an enlarged via cap in a direction that does not violate said minimum distance.

12. The cell of claim 11 wherein said direction is in either a first direction or a second direction, which is substantially orthogonal to said first direction.

13. The cell of claim 10 wherein said minimum area of via overlap is formed as a trace to establish a connection with another via.

14. The cell of claim 10 wherein said at least one inverter is coupled in parallel to another inverter to form a multi-driver output configuration having increased drive strength.

15. The cell of claim 10 wherein said at least one circuit element is coupled in parallel to another circuit element to include a multi-driver output configuration having increased drive strength.

16. A cell forming a portion of a customizable logic array device, said cell comprising:

a base layer including circuit elements each having one or more inputs and one or more outputs;

a configuration layer configured to form a logic device from one or more of said circuit elements; and

an interlayer connection layer configured to connect each of said inputs and said outputs to said configuration layer so as to enable each of said circuit elements to be independently accessible, wherein

a first subset of said inputs and said outputs is used to form said logic device and a second subset of said inputs and said outputs is available to form other logic devices, wherein

an area of at least one element of said interlayer connection layer is less than a predefined minimum area and wherein

said configuration layer is configured to increase said area of said at least one element to be at least equal to said predefined minimum area.

17. The cell of claim 16 wherein said predefined minimum area is a minimum area of overlap for a connection formed by said interlayer connection layer.

18. The cell of claim 16 wherein said connection includes a via and said increase in area is obtained using a multi-dimensional via cap.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Apr 5, 2017
From: SILICON VALLEY BANK
To: CHIPX, INCORPORATED
Reel/Frame 041855/0702 →
AMENDED AND RESTATED INTELLECTUAL PROPERTY AGREEMENT Recorded Apr 6, 2016
From: CHIPX, INCORPORATED
To: SILICON VALLEY BANK
Reel/Frame 038369/0452 →
SECURITY INTEREST Recorded Apr 15, 2011
From: CHIPX, INC.
To: SILICON VALLEY BANK
Reel/Frame 026179/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2006
From: AMARILIO, LIOR; SEGAL, YOAV
To: CHIPX, INC.
Reel/Frame 018419/0084 →