IP Library › Assignment 038369/0452
Patent Assignment
Reel/Frame 038369/0452

Amended and Restated Intellectual Property Agreement

Recorded: 2016-04-06 Pages: 11
Assignor
CHIPX, INCORPORATED
Executed: 2016-04-05
Assignee
SILICON VALLEY BANK
2400 HANOVER STREET, PALO ALTO, CALIFORNIA, 95134
Covered Properties (5)
In-Circuit Device, System and Method to Parallelize Design and Verification of Application-Specific Integrated Circuits ("Asics") Having Embedded Specialized Function Circuits
Patent: 7,340,705 →
Application: 11/229,331 →
Cells of a Customizable Logic Array Device Having Independently Accessible Circuit Elements
Patent: 7,511,536 →
Application: 11/499,899 →
Publication: US 2008/0030228
Methods and Computer Readable Media Implementing a Modified Routing Grid to Increase Routing Densities of Customizable Logic Array Devices
Patent: 7,735,041 →
Application: 11/499,913 →
Publication: US 2008/0034341
Method of Developing Application-Specific Integrated Circuit Devices
Patent: 7,500,215 →
Application: 11/524,578 →
Method and Apparatus for Dqs Postamble Detection and Drift Compensation in a Double Data Rate (Ddr) Physical Interface
Patent: 7,675,811 →
Application: 12/082,100 →
Publication: US 2009/0251976
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2006
From: MASSABKI, ELIE H.; HIDY, JAY SHERMAN
To: CHIPX, INC.
Reel/Frame 017218/0507 →
Assignment of Assignor's Interest Sep 20, 2006
From: MASSABKI, ELIE H.; AMARILIO, LIOR
To: CHIPX, INCORPORATED
Reel/Frame 018334/0152 →
Assignment of Assignor's Interest Oct 20, 2006
From: AMARILIO, LIOR; SEGAL, YOAV
To: CHIPX, INC.
Reel/Frame 018419/0087 →
Assignment of Assignor's Interest Oct 20, 2006
From: AMARILIO, LIOR; SEGAL, YOAV
To: CHIPX, INC.
Reel/Frame 018419/0084 →
Assignment of Assignor's Interest Apr 7, 2008
From: AMARILIO, LIOR; SCHKOLNIK, DAVID; NADIR, OPHIR
To: CHIPX INCORPORATED
Reel/Frame 020816/0527 →
Security Interest Apr 15, 2011
From: CHIPX, INC.
To: SILICON VALLEY BANK
Reel/Frame 026179/0023 →
Release of Security Interest Apr 5, 2017
From: SILICON VALLEY BANK
To: CHIPX, INCORPORATED
Reel/Frame 041855/0702 →
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Assignment of Assignor's Interest Aug 4, 2017
From: CHIPX, INC.
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 043207/0470 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →