Integrating three-dimensional high capacitance density structures
Disclosed are three-dimensional dielectric structures on high surface area electrodes and fabrication methods. Exemplary structures comprise a copper foil substrate, trench electrodes or high surface area porous electrode structures formed on the substrate, a insulating thin film formed on the surface and laminating the foil on a organic substrate. A variety of materials may be used to make the films including perovksite ceramics such as barium titanate, strontium titanate, barium strontium titanate (BST), lead zirconate titanate (PZT); other intermediate dielectric constant films such as zinc oxide, aluminum nitride, silicon nitride; typical paraelectrics such as tantalum oxide, alumina, and titania. The films may be fabricated using sol-gel, hydrothermal synthesis, anodization or vapor deposition techniques.
1. Apparatus comprising:
a metal foil on an organic substrate;
nonplanar three-dimensional conducting surfaces formed on the metal foil on the organic substrate;
an insulating thin film conformally formed on the conducting surfaces by chemically reacting the surface while immersed in a solution; and
a second conducting layer conformally coated on top of the insulating thin film to form a capacitor or battery that is integrated as a part of the organic substrate.
2. The apparatus recited in claim 1 wherein the nonplanar surfaces are formed by electroplating conducting structures on the metal foil through a patterned polymer and subsequently removing the polymer.
3. The apparatus recited in claim 1 wherein the three-dimensional conducting surfaces are formed by wet or plasma etching the metal foil.
4. The apparatus recited in claim 1 wherein the three dimensional conducting surfaces are formed on a metal foil comprising titanium, niobium, tantalum, zinc, copper, or aluminum.
5. The apparatus recited in claim 1 wherein the nonplanar conducting surfaces are insulated by reacting with a heated metal ion solution to form the corresponding compound insulating film.
6. The apparatus recited in claim 1 wherein the insulating thin film is formed by a electrochemical oxidation process by anodizing the metal foil in a solution bath.
7. The apparatus recited in claim 1 wherein the insulating thin film is formed by a electrochemical oxidation process by anodizing the metal foil in a electrochemical solution bath.
8. Apparatus comprising:
a metal foil on an organic substrate;
a three-dimensional conducting surface on the metal foil on the organic substrate with organic layers, the three-dimensional conducting surface comprising a partially fused metal particle layer formed by heat treating a layer of metal paste;
an insulating thin film formed on the conducting surface; and
a conducting layer conformally coated on top of the insulating thin film to form a capacitor or battery that is integrated as a part of the organic substrate.
9. The apparatus recited in claim 8 wherein the substrate comprises thin copper, nickel or similar metal foil that is laminated onto another substrate.
10. The apparatus recited in claim 8 wherein the conducting surfaces are formed on a metal foil comprising titanium, niobium, tantalum, zinc, copper, aluminum, nickel, or chromium.
11. The apparatus recited in claim 8 wherein the insulated coating is formed by depositing a metallorganic solution coating that is then heat treated in a controlled oxygen, nitrogen or hydrogen environment.
12. The apparatus recited in claim 8 wherein the three-dimensional electrode is insulated by reacting with an metal ion solution to form the corresponding compounds.
13. The apparatus recited in claim 8 where the insulating thin film is formed on the conducting surface by heat treating the three-dimensional surface in air or nitrogen to form thin dielectric coating layers comprising metal oxides or nitrides.
14. The apparatus recited in claim 8 where the insulating thin film is formed on the conducting surface by chemical or physical vapor deposition thin insulating layers.
15. The apparatus recited in claim 8 where the insulating thin film is formed on the conducting surface by coating a polymer solution layer that is then cured to form the polymer thin film insulating layer.