System for controlling the temperature of electronic devices

1. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose an electronic device coupled to a platform;

a seal configured to be compressed directly between the housing and the platform; and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device.

2. The system of claim 1 , wherein the housing has five walls that define an open side configured to receive the electronic device there through.

3. The system of claim 1 , further comprising a fastening mechanism configured to removably attach the housing to the platform.

4. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose an electronic device coupled to a platform;

a seal configured to be positioned between the housing and the platform; and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device, wherein the fastening mechanism is one or more screws that are configured to attach the housing to the platform.

5. The system of claim 1 , wherein the heat transfer mechanism is positioned at least partially within the housing.

6. The system of claim 5 , wherein the heat transfer mechanism comprises a heat-exchanger positioned within the housing.

7. The system of claim 1 , wherein the heat transfer mechanism comprises a thermoelectric heat-pump.

8. The system of claim 7 , wherein the thermoelectric heat-pump is a Peltier module.

9. The system of claim 7 , further comprising a controller electrically coupled to the thermoelectric heat-pump.

10. The system of claim 9 , wherein the controller is electrically coupled to at least one temperature sensor within the housing.

11. The system of claim 1 , wherein the heat transfer mechanism comprises:

at least one heat-exchanger that is configured to be coupled to a controllable temperature source; and

at least one thermoelectric heat-pump coupled to the heat-exchanger, where the thermoelectric heat-pump is configured to transfer heat between the heat-exchanger and the electronic device.

12. The system of claim 11 , wherein the heat transfer mechanism further comprises a old-plate coupled to the thermoelectric heat-pump, where the cold-plate is configured to couple to the electronic device.

13. The system of claim 12 , further comprising a temperature sensor embedded into the cold-plate.

14. The system of claim 11 , further comprising a temperature sensor coupled to the heat-exchanger within the housing.

15. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose an electronic device coupled to a platform;

a seal configured to be positioned between the housing and the platform; and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device, wherein the heat transfer mechanism comprises;

at least one heat-exchanger that is configured to be coupled to a controllable temperature source; and

at least one thermoelectric heat-pump coupled to the heat-exchanger, where the thermoelectric heat-pump is configured to transfer heat between the heat-exchanger and the electronic device, and

wherein the controllable temperature source comprises:

a bath configured to contain thermally conductive fluid;

an inlet line fluidly coupling the bath to an inlet of the heat-exchanger; and

an outlet line fluidly coupling an outlet of the heat-exchanger to the bath.

16. The system of claim 15 , further comprising at least one pump fluidly coupled to the inlet line and the outlet line.

17. The system of claim 16 , wherein the at least one pump is electrically coupled to a controller.

18. The system of claim 1 , wherein the seal is compressible.

19. The system of claim 1 , further comprising one or more ports into the housing for introducing or expelling gas from within the housing.

20. The system of claim 1 , wherein the housing includes a lip that, when the housing is coupled to the platform, compresses the heat transfer mechanism into contact with the electronic device.

21. The system of claim 1 , further comprising an additional seal configured to be positioned on an opposite side of the platform to the electronic device.

22. The system of claim 21 , wherein the additional seal covers an area of the platform at least as large as the electronic device.

23. The system of claim 22 , further comprising an insulation housing configured to be coupled to the additional seal on a side of the additional seal opposite to the platform.

24. The system of claim 1 , wherein the heat transfer mechanism includes a heat-exchanger embedded into the housing.

25. The system of claim 1 , wherein the heat transfer mechanism is positioned on the outside of the housing.

26. The system of claim 1 , further comprising multiple additional electronic Devices coupled to the platform within the housing.

27. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose multiple electronic devices coupled to a platform;

a seal configured to be compressed directly between the housing and the platform; and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device.

28. The system of claim 27 , wherein the housing has five walls that define an open side configured to receive the electronic device there through.

29. The system of claim 27 , further comprising a fastening mechanism configured to removably attach the housing to the platform.

30. The system of claim 27 , wherein the heat transfer mechanism is positioned at least partially within the housing.

31. The system of claim 30 , wherein the heat transfer mechanism comprises a heat-exchanger positioned within the housing.

32. The system of claim 30 , wherein the heat transfer mechanism comprises a thermoelectric heat-pump.

33. The system of claim 27 , wherein the heat transfer mechanism comprises:

at least one heat-exchanger that is configured to be coupled to a controllable temperature source; and

at least one thermoelectric heat-pump coupled to the heat-exchanger, where the thermoelectric heat-pump is configured to transfer heat between the heat-exchanger and the electronic device.

34. The system of claim 33 , wherein the heat transfer mechanism further comprises a cold-plate coupled to the thermoelectric heat-pump, where the cold-plate is configured to couple to the multiple electronic devices

35. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose multiple electronic devices coupled to a platform:

a seal configured to be positioned between the housing and the platform: and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device, wherein the heat transfer mechanism comprises:

at least one heat-exchanger that is configured to be coupled to a controllable temperature source: and

at least one thermoelectric heat-pump coupled to the heat-exchanger, where the thermoelectric heat-pump is configured to transfer heat between the heat-exchanger and the electronic device, and wherein the controllable temperature source comprises:

a bath configured to contain thermally conductive fluid;

an inlet line fluidly coupling the bath to an inlet of the heat-exchanger; and

an outlet line fluidly coupling an outlet of the heat-exchanger to the bath.

36. The system of claim 27 , wherein the seal is compressible.

37. A system for controlling the temperature of electronic devices under test, the system comprising:

a housing configured to removably enclose multiple electronic devices coupled to a platform:

a seal configured to be positioned between the housing and the platform: and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device, further comprising an additional seal configured to be positioned on an opposite side of the platform to the electric device.

38. A system for testing multiple electronic devices, the system comprising:

a housing configured to removably enclose one or more of multiple electronic devices coupled to a platform;

a seal coupled to the housing and configured to be compressed directly during testing between the housing and the platform; and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device;

a mechanism for sequentially enclosing each of said one or more of said multiple electronic devices.

39. A system for testing multiple electronic devices, the system comprising:

a housing configured to removably enclose one or more of multiple electronic devices coupled to a platform:

a seal coupled to the housing and configured to be positioned during testing between the housing and the platform: and

a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the electronic device:

a mechanism for sequentially enclosing each of said one or more of said multiple electronic devices, wherein said mechanism comprises an arm that raises and lowers the housing over different electronic devices.

40. The system of claim 38 , wherein movement of said arm is controlled by a Controller without human intervention after initiation.

41. The system of claim 38 , wherein said mechanism is configured to move said platform.