Semiconductor package film having reinforcing member and related display module
Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.
1. A semiconductor package film comprising:
a base film comprising:
a plurality of semiconductor device regions, wherein each semiconductor device region comprises:
a semiconductor mounting region adapted to receive a semiconductor chip; and
first and second metal line regions, wherein the first and second metal line regions each partially overlap the semiconductor mounting region, the first metal line region comprises a first plurality of metal lines adapted to electrically connect the semiconductor chip to a first external apparatus, and the second metal line region comprises a second plurality of metal lines adapted to electrically connect the semiconductor chip to a second external apparatus;
an intermediate region disposed on a first surface of the base film and disposed between two of the semiconductor device regions;
edge regions disposed at opposite ends of the intermediate region; and
a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region and disposed perpendicularly to the edge regions, and
wherein a length of the reinforcing member along a first dimension is less than a length of the intermediate region along the first dimension.
2. The film of claim 1 wherein the length of the reinforcing member along a second dimension orthogonal to the first dimension is greater than the length of the intermediate region along the second dimension.
3. The film of claim 1 , wherein the base film further comprises:
first and second edge regions, wherein each of first and second edge regions comprises a plurality of processing sprocket holes;
first and second edge reinforcing members attached respectively to the first and second edge regions; and,
the reinforcing member is connected to the first and second edge reinforcing members.
4. The film of claim 1 , wherein:
the base film further comprises first and second edges regions;
each of first and second edge regions comprises a plurality of processing sprocket holes;
first and second edge reinforcing members are attached to the first and second edge regions, respectively; and,
the reinforcing member is separated from each of the first and second edge reinforcing members.
5. The film of claim 1 , wherein the reinforcing member is formed from a flexible material.
6. The film of claim 1 , wherein the reinforcing member is formed from a non-flexible material.