Gallium nitride-based semiconductor light emitting device and process for its production

1. A semiconductor light emitting device characterized by comprising an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer in that order on a substrate, with a negative electrode and positive electrode each formed in contact with the n-type semiconductor layer and p-type semiconductor layer, respectively, wherein the positive electrode comprises at least a contact metal layer composed of at least one type of metal selected from the group consisting of Pt, Ir, Rh, Pd, Ru and Re or their alloy in contact with the p-type semiconductor layer, a reflective layer composed of a metal or alloy containing Ag as the main component on the contact layer, and one or more protective metal layers containing no Ag, completely covering the top and side surfaces of the reflective layer

wherein the thicknesses of the one or more protective metal layers are between 500 nm and 10 μm; and

wherein an undercoat layer composed of at least one metal selected from among Pt, Ir, Rh, Pd, Ru and Re or an alloy comprising at least one of these metals is formed between the reflective layer and the one or more protective metal layers in contact with the both layers.

2. The semiconductor light emitting device according to claim 1 , characterized in that the Ag content of the reflective layer composed mainly of Ag is 90-99.99 wt %.

3. The semiconductor light emitting device according to claim 1 , characterized in that at least one layer among the one or more protective metal layers is formed by a plating process.

4. The semiconductor light emitting device according to claim 3 , characterized in that the metal formed by the plating process is any metal from among Ni, Cu, Au and Cr or an alloy composed mainly of at least one of these metals.

5. The semiconductor light emitting device according to claim 3 , comprising a metal layer formed by means other than a plating process on the one or more protective metal layers formed by the plating process.

6. The semiconductor light emitting device according to claim 5 , characterized in that the metal layer formed by means other than a plating process is a metal or alloy composed mainly of Au or Al.

7. The semiconductor light emitting device according to claim 1 , characterized in that at least portions of the side surfaces of the n-type semiconductor layer form an inclination angle with respect to the normal to the semiconductor layer surface.

8. The semiconductor light emitting device according to claim 7 , characterized in that the inclination angle is a positive angle with respect to the normal to the n-type semiconductor layer surface.

9. The semiconductor light emitting device according to claim 8 , characterized in that the inclination angle is 30°-70° as the angle formed between the normal to the n-type semiconductor layer surface and the normal to the n-type semiconductor layer side surface.

10. The semiconductor light emitting device according to claim 7 , characterized in that the inclination angle is a negative angle with respect to the normal to the n-type semiconductor layer surface.

11. The semiconductor light emitting device according to claim 10 , characterized in that the inclination angle is 30°-70° as the angle formed between the normal to the semiconductor layer surface and the normal to the semiconductor layer side surface.

12. The semiconductor light emitting device according to claim 1 , characterized in that the semiconductor is a Group III-V semiconductor.

13. The semiconductor light emitting device according to claim 12 , characterized in that the Group III-V semiconductor is a gallium nitride-based semiconductor.

14. A light emitting device obtained by combining a fluorescent material with a semiconductor light emitting device according to claim 1 .

15. A lamp employing a light emitting device according to claim 1 .

16. A process for fabrication of a semiconductor light emitting device characterized by comprising an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer in that order on a substrate, with a negative electrode and positive electrode each formed in contact with the n-type semiconductor layer and p-type semiconductor layer, respectively, wherein the positive electrode comprises at least a contact metal layer composed of at least one type of metal selected from the group consisting of Pt, Ir, Rh, Pd, Ru and Re or their alloy in contact with the p-type semiconductor layer, a reflective layer composed of a metal or alloy containing Ag as the main component on the contact layer, and one or more protective metal layers containing no Ag, completely covering the top and side surfaces of the reflective layer

wherein the thicknesses of the one or more protective metal layers are between 500 nm and 10 μm; and

wherein an undercoat layer composed of at least one metal selected from among Pt, Ir, Rh, Pd, Ru and Re or an alloy comprising at least one of these metals is formed between the reflective layer and the one or more protective metal layers in contact with the both layers,

said process characterized by forming an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer in that order on a substrate, providing a negative electrode and positive electrode in contact with the n-type semiconductor layer and p-type semiconductor layer, respectively, forming as the positive electrode at least a contact metal layer composed of at least one type of metal selected from the group consisting of Pt, Ir, Rh, Pd, Ru and Re or their alloy in contact with the p-type semiconductor layer, and a reflective layer composed of a metal or alloy containing Ag as a component on the contact layer, and forming at least one protective metal layer containing no Ag, completely covering the top and side surfaces of the reflective layer, by a plating process.